Laser sintering of copper nanoparticles on top of silicon substrates
Laser sintering of copper nanoparticles on top of silicon substrates
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DOI：
10.1088/0957-4484/27/3/035203
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发表时间：
2016-01-22
期刊：
影响因子：
3.5
通讯作者：
Mantysalo, M.
中科院分区：
文献类型：
--
作者：
Soltani, A.;Vahed, B. Khorramdel;Mantysalo, M.
本研究探讨在室内环境中使用激光作为高速烧结方法的喷墨印刷纳米颗粒铜油墨的烧结。印刷图案烧结增加激光扫描速度高达400毫米秒（-1）。测量烧结结构的结晶度并相对于扫描速度作图。增加的电阻率似乎与增加的扫描速度相关。选择的分析方法被用来研究烧结结构的微观结构和组成的差异。根据结果，在使用20 mm s（-1）至400 mm s（-1）扫描速度烧结的结构之间没有观察到可辨别的微观结构差异;只有使用5 mm s（-1）速度扫描的结构显示出极大不同的微观结构，并且在该结构上没有可测量的电阻率。成分研究表明，除了以5 mm s（-1）速度扫描的结构含有最高的氧外，其余结构显示出随扫描速度增加而稳定的氧增加。
This study examines the sintering of inkjet printed nanoparticle copper ink in a room environment using a laser as a high speed sintering method. Printed patterns were sintered with increasing laser scanning speed up to 400 mm s(-1). The resistivities of the sintered structures were measured and plotted against the scanning speeds. Increased resistivity seems to correlate with increased scanning speed. A selections of analytical methods was used to study the differences in microstructure and composition of the sintered structures. Based on the results, no discernable difference in the microstructure was noticed between the structures sintered using 20 mm s(-1) to 400 mm s(-1) scanning speeds; only the structure scanned using 5 mm s(-1) speed showed a vastly different microstructure and no resistivity was measurable on this structure. Compositional studies revealed that, apart from the structure scanned with 5 mm s(-1) speed which contained the highest oxygen, the rest of the structures showed a steady oxygen increase with increased scanning speed.