Mechanism of nodular growth in copper electrorefining with the inclusion of impurity particles under natural convection
Mechanism of nodular growth in copper electrorefining with the inclusion of impurity particles under natural convection
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DOI：
10.1016/j.hydromet.2022.106013
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发表时间：
2022-12-17
期刊：
影响因子：
4.7
通讯作者：
Murase, Kuniaki
中科院分区：
文献类型：
--
作者：
Miyamoto, Masayuki;Mitsuno, Shohei;Murase, Kuniaki
通过对结核内部杂质元素的定量分析、晶体结构的观察以及基于三次电流分布的自然对流数值模拟，研究了铜电解精炼中夹杂杂质颗粒的结核生长行为。结核上半部的杂质含量高于下半部或非结核生长的电解铜。悬浮粘液等杂质颗粒沿着结核上方出现的对流涡流循环时，由于与结核上部频繁碰撞，被认为优先被带入结核上部。杂质颗粒的夹杂改变了电沉积形态和生长方向，最终在初始结核的上表面产生粒状不规则性和新结核的芽体。
Nodular growth behavior with the inclusion of impurity particles in copper electrorefining was investigated herein by quantitative analyses of impurity elements inside nodules, observations of crystal structures, and numerical simulations of natural convection based on the tertiary current distribution. Impurity contents were higher in the upper half of the nodule than in either the lower half or electrolytic copper with non-nodulous growth. Impurity particles, such as suspended slime, were considered to be preferentially taken into the upper part of nodules due to frequent collisions with the upper part as they circulated along the convection vortex that emerged above the nodule. The inclusion of impurity particles changed the electrodeposition morphology and growth direction, and eventually produced granular irregularities and buds of new nodules on the upper surface of the initial nodule.