Room temperature UV adhesive bonding of CE devices
Room temperature UV adhesive bonding of CE devices
复制标题
DOI：
10.1039/b805554h
复制
发表时间：
2008-09-01
期刊：
影响因子：
6.1
通讯作者：
Baldwin, Richard P.
中科院分区：
文献类型：
--
作者：
Carroll, Susan;Crain, Mark M.;Baldwin, Richard P.
用于芯片实验室玻璃器件的一种简单的低温粘合剂“印章和粘接”程序已被测试用于毛细管电泳法。这项技术包括使用掩膜对准器将可UV固化的粘合剂选择性地转移到顶部CE基板上，然后将其与底部CE晶片对准并粘合在一起。整个粘接过程可以在室温下在不到30分钟的时间内完成，只需进行用户友好的实验室操作，并且提供了近100%的成功率。用这种方法制作的CE微芯片具有与传统高温热键合制得的芯片相似的电渗流和分离特性。同样重要的是，这些设备在几周的使用中提供了稳定的长期性能，包括数百次单独的CE运行，没有结构故障或操作特征的任何明显变化。最后，这些器件表现出极好的芯片间重复性。要成功地采用邮票和粘贴法，确实需要开发和测试新的但容易实施的结构特征，这些特征被纳入芯片设计中，其性质得到了详细的描述。
A simple low temperature adhesive 'stamp-and-stick' bonding procedure for lab-on-a-chip glass devices has been tested for capillary electrophoresis applications. This technique involves use of a mask aligner to transfer a UV-curable adhesive selectively onto the top CE substrate which is then aligned with and bonded to the bottom CE wafer. The entire bonding process can be carried out at room temperature in less than 30 minutes, involved only user-friendly laboratory operations, and provided a near 100% success rate. CE microchips made in this manner exhibited similar electroosmotic flow and separation characteristics as ones made via conventional high temperature thermal bonding. Equally important, the devices provided stable long-term performance over weeks of use, encompassing hundreds of individual CE runs without structural failure or any apparent change in operating characteristics. Finally, these devices exhibited excellent chip-to-chip reproducibility. Successful adaptation of the stamp-and-stick approach did require the development and testing of new but easily implemented structural features which were incorporated into the chip design and whose nature is described in detail.