Extrusion formation mechanism on silicon surface under the silica cluster impact studied by molecular dynamics simulation
Extrusion formation mechanism on silicon surface under the silica cluster impact studied by molecular dynamics simulation
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分子动力学模拟研究硅簇撞击下硅表面挤压形成机制
DOI：
10.1063/1.3021458
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发表时间：
2008-11
影响因子：
3.2
通讯作者：
Guo D
中科院分区：
文献类型：
--
作者：
Luo JB;Lu XC;Chen RL;Guo D
分子动力学模拟被应用于分析大尺寸二氧化硅团簇撞击下硅表面的变形。这种变形的机制与离子轰击和压痕的情况有很大不同。随着……的撞击（句子不完整）
Molecular dynamic simulation is applied in analyzing the deformation of silicon surface under the impact of large silica cluster. The mechanism of such a deformation is largely different from the cases of ion bombardment and indentation. With the impact of large silica cluster, the silicon surface is extruded due to the combinational effects of thermal spread, phase transformation, and crystallographic slip. It is found that thermal spread is the most significant one among these three effects. The extrusions on silicon surface will be in embryo during the impact unloading stage and will grow up during the cluster rebounding stage. Furthermore, the critical impact velocity to induce the formation of extrusions on silicon surface is associated with the incidence angle of the cluster, while it is independent from the size of the cluster. The findings are instructive in optimizing the process parameters for ultraprecision machining of silicon wafer.
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通过分子动力学模拟研究二氧化硅团簇撞击晶体硅基底过程中的相变
DOI：
10.1016/j.nimb.2008.04.012
发表时间：
2008-07
影响因子：
1.3
作者：
Guo, Dan;Chen, Ruling;Luo, Jianbin;Lu, Xinchun
通讯作者：
Lu, Xinchun
影响因子：
56.9
作者：
CLEVELAND, CL;LANDMAN, U
通讯作者：
LANDMAN, U
DOI：
10.1016/j.nimb.2004.10.021
发表时间：
2005
影响因子：
1.3
作者：
T. Aoki;J. Matsuo
通讯作者：
T. Aoki;J. Matsuo
影响因子：
1.5
作者：
Takanobu Watanabe;H. Fujiwara;Hidekazu Noguchi;T. Hoshino;I. Ohdomari
通讯作者：
Takanobu Watanabe;H. Fujiwara;Hidekazu Noguchi;T. Hoshino;I. Ohdomari
影响因子：
8.6
作者：
Pérez;Payne;Simpson
通讯作者：
Pérez;Payne;Simpson