A novel fractional viscoelastic constitutive model for shape memory polymers
A novel fractional viscoelastic constitutive model for shape memory polymers
复制标题
形状记忆聚合物的新型分数粘弹性本构模型
DOI：
10.1002/polb.24631
复制
发表时间：
2018-08-15
影响因子：
--
通讯作者：
Liu, Zishun
中科院分区：
文献类型：
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作者：
Pan, Zhouzhou;Liu, Zishun
形状记忆聚合物（SMP）是一类能够在一定的外部刺激下从变形形状恢复到原始形状的智能材料。为了预测形状记忆聚合物的变形行为，过去几年开发了不同的本构模型。然而，大多数本构模型需要通过具体的实验和复杂的校准过程来确定许多参数。这一缺点限制了它们在促进SMP发展方面的应用。因此，开发一种既准确又相对简单的新本构模型势在必行。在我们的工作中，首次为SMP提出了一种与时间-温度叠加原理耦合的新型分数粘弹性本构模型。然后进行频率扫描和温度扫描实验以确定模型的参数。最后，进行无形状记忆恢复实验以验证所开发模型的预测能力。通过将预测结果与实验数据进行比较，我们发现虽然我们的模型总共只有 11 个参数，但它可以捕获 SMP 的热机械行为，与实验结果非常吻合。我们希望所提出的新模型为研究人员设计和优化 SMP 应用提供指导。 (C) 2018 年 Wiley 期刊公司。
Shape memory polymers (SMPs) are a class of smart materials which can recover from a deformed shape to their original shape by a certain external stimulus. To predict the deformation behaviors of SMPs, different constitutive models have been developed in the last few years. However, most of the constitutive models need many parameters to be determined by specific experiments and complex calibration processes. This drawback has limited their application in promoting the development of SMPs. Thus, it is imperative to develop a new constitutive model which is not only accurate, but also relatively simple. In our work, a novel fractional viscoelastic constitutive model coupling with time-temperature superposition principle is first proposed for SMPs. Then, frequency sweep and temperature sweep experiments are conducted to determine the parameters of the model. Finally, the shape memory free recovery experiments are carried out to validate the predictive capability of the developed model. By comparing the predicted results with experimental data, we find that though our model has only eleven parameters in total, it could capture the thermomechanical behaviors of SMPs in very good agreement with experimental results. We hope the proposed new model provide researchers with guidelines in designing and optimizing of SMP applications. (C) 2018 Wiley Periodicals, Inc.