Facile Preparation of High‐Performance Elastically Stretchable Interconnects
Facile Preparation of High‐Performance Elastically Stretchable Interconnects
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DOI:
10.1002/adma.201501461
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发表时间:
2015-07
影响因子:
29.4
通讯作者:
A. Polywka;Timo Jakob;Luca Stegers;T. Riedl;P. Görrn
中科院分区:
文献类型:
--
作者:
A. Polywka;Timo Jakob;Luca Stegers;T. Riedl;P. Görrn
Sites on poly(dimethylsiloxane) are selected by ultraviolet exposure. In a subsequent electroless deposition, solid silver films are created on the selected sites only. In this way, facile vacuum-free deposition of electrodes from the liquid phase and their photoresist- and solvent-free patterning are realized. The technique enables reliable rigid-to-soft interconnects that are reversibly stretchable under arbitrary and changing stretching directions.