Preliminary Experimental Study of Countercurrent Through- Hole Plating of Printed Circuit Boards

这一创新研究快速奖是为了支持一项关于在非常小的孔的内表面快速而均匀地电镀的示范实验。这些孔洞出现在密集封装的印刷电路板上，所需的铜沉积要么缓慢而均匀，要么快速而不均匀。所提出的系统通过压力驱动流和在孔内旋转的螺旋槽电极驱动的流的组合来诱导适当的电解液流通过孔。这项研究是对这一概念的探索性评估。

This Expedited Award for Novel Research is in support of a demonstration experiment on the rapid and uniform electroplating of the inside surface of very small holes. These holes occur on densely packed printed circuit boards, and the necessary copper deposition has been either slow and uniform, or rapid and non-uniform. The proposed system induces an appropriate flow of electrolyte through the hole through a combination of pressure-driven flow and flow driven by a helically fluted electrode spinning inside the hole. The study is an exploratory assessment of this concept.