Morphology of Solid-Solid Phase Transformations during Thin Film Interdiffusion

这项研究旨在了解最近发现的 固-固相形态不稳定现象 转变 所研究的几何形状是 薄金属膜通过氧化层进入下面的金属。 在这些条件下可能发生界面不稳定性， 界面处的微刻面。 实验旨在 观察沉积在铝上的铜膜的转变 并测试一个预测结果的工作假设。 热台透射电子显微镜测量 不稳定波长和氧化层厚度。 轮廓仪 测量提供了对氧化层厚度的检查 通过显微镜测量。 %%% 这笔赠款的结果可能会影响重要的进程， 技术，例如不同材料的扩散结合和/或 衬底与薄金属膜的反应。

This research is aimed at understanding a recently discovered phenomenon of morphological instability in solid-solid phase transformations. The geometry under study is the diffusion of a thin metal film through an oxide layer into an underlying metal. Interface instabilities may occur under these conditions leading to microfacetting at the interface. Experiments are designed to observe the transformation in copper films deposited onto aluminum and test a working hypothesis developed to predict the results. Hot stage transmission electron microscopy is employed to measure instability wavelengths and oxide layer thicknesses. Profilometer measurements provide a check on the oxide layer thicknesses measured by microscopy. %%% The results of this grant could impact important processes in technology, such as diffusion bonding of different materials and/or reactions of substrates with thin metal films.