Enhancement Mechanism in the Nucleate Boiling and Convective Vaporization of Liquids on Microconfigured Surfaces

沸腾是最重要和最复杂的传热机制之一。最近对亚微米电子电路散热问题的关注为更好地理解沸腾提供了新的动力。该项目涉及微配置硅衬底上的直接相变和成核过程的研究。PI最近在密度范围为0.4 - 2 (10)5 / cm2的情况下使用11.5 >m特征的研究表明，在水中沸腾增强了350%，消除了FC-72中的迟滞和超调。未来的研究包括微特征间距、几何和表面处理的影响、更真实模型的开发、微秒级可视化以及温度波动的测量。过冷沸腾的测量也将进行。

Boiling is one of the most important and complex heat transfer mechanisms. Recent focus on heat dissipation problems for submicron electronic circuits brings new motivation for better understanding of boiling. This project concerns studies of direct phase change and nucleation processes on microconfigured silicon substrates. Recent studies by the PI employing 11.5 >m features at a density range of 0.4 - 2 (10)5 per cm2 showed a 350% boiling enhancement in water and the elimination of hysterias and overshoot in FC-72. Future studies include effects of microfeature spacing, geometry and surface treatments, development of a more realistic model, micro-second level visualization, and the measurement of temperature fluctuations. Subcooled boiling measurements will also be made.