A Novel Reinforcing Fiber for Enhancing Thermal Management

众所周知，糟糕的热管理是先进电子系统中电子元件可靠性和寿命的限制因素，这导致人们寻找用于电子元件的改进材料，如基板或散热器。在这项研究中，提出了一种新型的增强纤维--金刚石纤维，用于增强电子元器件的热管理。这种纤维将通过等离子体增强化学气相沉积(PECVD)技术在高度石墨化的亚微米石墨纤维上沉积多晶钻石来生产。钻石纤维的成功开发将为高密度、高功率电子元件的现有散热材料提供极好的补充，提供超高的导热系数、可裁剪的热膨胀系数和良好的机械性能。这项拟议的研究确定了一种显著的增强材料，以改善现有材料的热性能。这项研究的成功可能导致新的复合材料具有更高的导热系数和可定制的CTE，用于未来的电子设备。这些复合材料可用作基板和散热器。

It has been well-established that poor thermal management is a limiting factor in the reliability and lifetime of electronic components in advanced electronic systems, leading to the search for improved materials for electronic components such as substrates or heat sinks. In this research, a novel reinforcing fiber, diamond fiber, for enhancing thermal management in electronic components is proposed. The fibers will be produced by depositing polycrystalline diamonds on highly graphitic, sub-micron graphite fiber through a plasma enhanced chemical vapor deposition (PECVD) technique. Successful development of diamond fibers will provide an excellent addition to available materials for heat removal for high density, high power electronic components, providing ultra high thermal conductivity, tailorable CTE, and good mechanical properties. The proposed research identifies an outstanding reinforcement to improve thermal performance of current materials. Success of the research could lead to new composites with much higher thermal conductivity and tailorable CTE for future electronic devices. These composites can be used as substrates and heat sinks.