The First ISHMT-ASME Heat and Mass Transfer Conference, Bombay, India, January 5-7, 1994, Group Travel Award in U.S.and Indian Currencies

9307614项目描述：该项目支持美国代表团参加由印度热质传递学会和美国机械工程学会联合举办的第一届热质传递会议。这次会议将于1994年1月5日至7日在孟买的巴巴原子研究中心举行。预计美国科学家将参加关于美国和印度研究和研究生教育的小组讨论，以及两国大学与产业合作研究的小组讨论。他们还将举办一个关于沸腾和冷凝的现代发展的研讨会，并将就新兴技术的主题举办最新的回顾讲座。他们将讲授传热学的实验方法，制造和材料加工中的传热学，以及电子系统中的热阻。美国科学家计划选择性地访问印度的研究机构，包括BARC和四家印度理工学院。范围：该项目将有助于发展美国和印度研究人员之间的密切联系，以交流技术信息，并开展共同感兴趣的合作研究项目。这次在印度举行的会议与亚洲机械工程师协会与中国、韩国、日本和欧洲的对应机构组织的其他会议类似。印度在这一特殊的热质传递领域拥有非常强大的研究人员群体，美国与会者很可能会从参加这次会议中受益。***

9307614 Soom Description: This project supports the participation of a U.S. delegation in the first Heat and Mass Transfer Conference organized jointly be the Indian Society of Heat and Mass Transfer (ISHMT) and the American Society of Mechanical Engineering (ASME). The conference will be held at the Bhabha Atomic Research Center (BARC) in Bombay between January 5 and 7, 1994. The American scientists are expected to participate in panel discussions on research and graduate education in the U.S. and India, and on university-industry cooperative research in the two countries. They will also conduct a symposium on modern developments in boiling and condensation, and will present state-of -the- art review lectures on topics of emerging technologies. They will give courses on experimental methods in heat transfer, heat transfer in manufacturing and material processing, and thermal resistance in electronic systems. The U.S. scientists plan to selectively visit Indian research institutes including BARC and four of the Indian Institutes of Technology. Scope: This project will help develop close ties between researchers in the U.S. and India for exchange of technical information and for conducting cooperative research projects of mutual interest. This meeting in India is similar to others organized by the ASME with counterpart organizations in China, South Korea, Japan and Europe. India has a very strong community of researchers in this particular field of heat and mass transfer, and it is likely that the U.S. participants will benefit from attending this conference. ***