ARI: Acquisition of Shrink Small Outline Integrated Circuit (SSOIC) Board Production Facility

该合同为收购库柏联合公司的小型集成电路（SSOIC）板生产设施提供资金。该设施将允许研究和教育表面安装晶体管或表面安装技术。这些技术使集成电路的制造尺寸大约是以前双列式集成电路的四分之一。双列电路可以放置在插座和手线包裹成一个电子电路。表面贴装设备太小，无法手工布线。相反，它们必须焊接在多层电路板上，引线间距小至0.5毫米。该设备将支持血液流速传感、心电图相位分析、智能电话控制系统和先进通信设备（包括基于数字信号处理器的语音识别/验证系统）的研究。该设施将使库珀联盟的电气工程教师和学生保持在当前技术的前沿，更好地为国家的技术基础设施和全球竞争力做出贡献。＊＊＊

9512161 Costello The award provides funds for the acquisition of a shrink small outline integrated circuit (SSOIC) board production facility at Cooper Union. This facility will allow research and education surface mount transistors or surface mount technologies. These technologies enable the fabrication of integrated circuits that are about one-fourth of the size of previous dual-in-line integrated circuits. Dual-in-line circuits can be placed in sockets and hand wire-wrapped into an electronic circuit. Surface mount devices are too small to be hand wired. Instead, they must be soldered onto a multi-layer circuit board with lead spacing as small as 0.5 mm. This equipment will support research in blood velocity sensing, phase analysis of EKGs, smart telephone control systems, and advanced communication devices including a digital-signal-processor-based voice identification/verification system. This facility will enable Cooper Union's electrical engineering faculty and student to remain in the forefront of current technology and better contribute to the nation's technological infrastructure and global competitiveness. ***