NSF IUCRC for Wireless Information Networks: TIE Program between University of Calfornia San Diego and The State University of New Jersey

NSF IUCRC 无线信息网络：加州大学圣地亚哥分校和新泽西州立大学之间的 TIE 计划

• 批准号: 9714727
• 负责人: David Goodman
• 金额: $ 5万
• 依托单位: Rutgers University New Brunswick
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-08-15 至 1999-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9714727&HistoricalAwards=false
• 关键词: NSF; IUCRC; Wireless; Information; Networks

ABSTRACT EEC-9714727 GOODMAN This two year "TIE" project funds a collaborative study with two Industry/University Cooperative Research Centers (I/UCRC). The two I/UCRC's are the Rutgers University Industry/University Cooperative Research Center for Wireless Information Networks and the University of California San Diego Industry/University Cooperative Research Center for Ultra-High Speed Integrated Circuits and Systems. The "TIE" project is entitled, "Interference Cancellation Prototyping and ASIC Development for Wireless CDMA Communication." The Rutgers University I/UCRC will investigate the critical issues of acquisition and synchronizing essential for multi-user direct sequence CDMA communication convolution coding and utilize recent results on multi carrier DS/CDMA systems. In the second year further research to study other multi-user detection architecture will be carried out after adding radio frequency hardware. The University of California - San Diego Center will work with the Rutgers University Center in designing an interference cancellation chip and give it to National Semiconductor Corp. for fabrication . In the second year the chip will be tested and incorporated into a CDMA communication system for multi-users.

这个为期两年的“TIE”项目资助了一项与两个工业/大学合作研究中心（I/UCRC）的合作研究。这两个I/UCRC是罗格斯大学工业/大学无线信息网络合作研究中心和加州大学圣地亚哥分校超高速集成电路与系统工业/大学合作研究中心。“TIE”项目名为“无线CDMA通信的干扰消除原型和ASIC开发”。罗格斯大学I/UCRC将研究多用户直接序列CDMA通信卷积编码所需的获取和同步关键问题，并利用多载波DS/CDMA系统的最新成果。在加入射频硬件后，第二年将进一步研究其他多用户检测体系结构。加州大学圣地亚哥中心将与罗格斯大学中心合作设计一种干扰消除芯片，并将其交给国家半导体公司制造。第二年，该芯片将被测试并集成到多用户CDMA通信系统中。