SBIR Phase I: A New Environmentally Conscious Direct Metallization Process for Manufacturing Printed Wiring Boards

Lynntech Inc.将开发一种用于制造印刷线路板(PWB)的新添加剂工艺，该工艺基于导电聚合物的光聚合。该工艺不需要导电衬底来沉积导电聚合物，并且铜膜、线和/或通孔很容易以高分辨率电镀在聚合物上。这种工艺技术在需要高分辨率印刷电路板的印刷电路板制造中有着重要的应用前景，工艺浪费最小化势在必行。

Lynntech Inc. will develop a new additive process for manufacturing of printed wiring boards (PWBs) which is based on the photopolymerisation of conducting polymers. This process does not require a conducting substrate for deposition of conducting polymers, and copper films, lines and/or through-holes are readily electroplated on the polymer with high resolution. This process technique holds significant promise in PWB manufacturing, where high resolution PCBs are needed and process waste minimisation is imperative.