SBIR Phase I: A New Environmentally Conscious Direct Metallization Process for Manufacturing Printed Wiring Boards

SBIR 第一阶段：用于制造印刷线路板的新型环保直接金属化工艺

• 批准号: 9760331
• 负责人: Dalibor Hodko
• 金额: $ 10万
• 依托单位: Lynntech, Inc
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1998
• 资助国家: 美国
• 起止时间: 1998-01-01 至 1998-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9760331&HistoricalAwards=false
• 关键词: SBIR; Phase; New; Environmentally; Conscious

Lynntech Inc. will develop a new additive process for manufacturing of printed wiring boards (PWBs) which is based on the photopolymerisation of conducting polymers. This process does not require a conducting substrate for deposition of conducting polymers, and copper films, lines and/or through-holes are readily electroplated on the polymer with high resolution. This process technique holds significant promise in PWB manufacturing, where high resolution PCBs are needed and process waste minimisation is imperative.

Lynntech Inc.将开发一种基于导电聚合物光聚合的新的印刷线路板（PWB）制造增材工艺。 该方法不需要用于沉积导电聚合物的导电基底，并且铜膜、线和/或通孔容易以高分辨率电镀在聚合物上。 这种工艺技术在PWB制造中具有重要的前景，其中需要高分辨率PCB，并且工艺废物最小化势在必行。