Improving Soft Soil Mechanical Properties Using an Innovative Grouting Methodoloy

*9820773 Alshawabke.这个探索性研究小额拨款项目涉及对一种新的、创新的软土加固技术进行小规模探索性调查。离子在电场下的迁移将被用来注入带电添加剂，以通过胶结来稳定土壤。该项目将展示离子迁移在改善土壤特性方面的潜在用途，例如压缩和剪切强度。由于这项技术不依赖于孔隙流体流动，因此它可以有效地应用于低导水率的土壤，而土壤体积变化很小或没有变化。如果得到证实，这项技术将允许在合理的时间段内实现原位稳定，而不会造成较大的体积变化。在本研究中，将采用注浆方法对粘土样品进行注浆，并在注浆前和注浆后进行力学测试，以评估力学性能的改善程度。将评估土壤的电化学性质，并评估孔隙流体化学和Ph对电渗流速度的影响。为了在电化学稳定试验中控制电渗流，这一步骤是必要的。然后，将在不施加电场的情况下进行批量测试，以评估添加剂在改善土壤力学性质方面的有效性。最后，将利用电场进行小试，以验证电场下离子迁移胶结土壤的有效性。***

***9820773 AlshawabkehThis Small Grant for Exploratory Research (SGER) project involves a small-scale, exploratory investigation of a new and innovative technique for soft soil stabilization. Ion migration under electric fields will be used to inject charged additives in order to stabilize soils via cementation. This project will demonstrate the potential use of ion migration to improve soil characteristics such as compressibility and shear strength. Because the technique does not depend on pore fluid flow, it can be used effectively in soils with low hydraulic conductivity with little or no associated soil volume change. If proven out, this technique will permit in situ stabilization in a reasonable time period without causing large volume changes. In this study, the grouting methodology will be applied to clay samples, and mechanical testing will be performed before and after grouting to assess the degree of mechanical property improvement. The electrochemical properties of the soil will be evaluated and the impact of pore fluid chemistry and Ph on the rate of electroosmotic flow will be assessed. This step is necessary in order to control electroosmotic flow during the electrochemical stabilization tests. Batch tests will then be conducted without the application of electric fields in order to assess the effectiveness of additives on improving soil mechanical properties. Finally, bench-scale tests will be conducted using electric fields to demonstrate the effectiveness of soil cementation by ion migration under electric fields. ***