SBIR Phase I: Fabrication of Photonic Band Gap Structures Embedded in Low Temperature Co-fired Ceramic for Millimeter Wave Applications

SBIR 第一阶段：用于毫米波应用的嵌入低温共烧陶瓷中的光子带隙结构的制造

• 批准号: 9960011
• 负责人: Danny Eliyahu
• 金额: $ 10万
• 依托单位: WAVEBAND CORPORATION
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-01-01 至 2000-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9960011&HistoricalAwards=false
• 关键词: SBIR; Phase; Fabrication; Photonic; Band

This Small Business Innovation Research Phase I project addresses development of a new material for microwave electronics. As microwave applications, including portable wireless devices, expand, and as digital integrated circuit speeds and clock rates increase to the millimeter wave (MMW) range, the need arises for a low-loss dimensionally stable dielectric with properties uniform over a broad range of frequencies and environmental conditions. The main challenge is to find a way of guiding MMW radiation through a dielectric substrate with minimal scattering losses, and of creating low-loss resonant cavities.Waveband Corporation proposes to develop a new technique to embed Photonic Band Gap Structures (PBSs) in ceramic substrates at an early stage of fabrication. The PBSs will reduce radiative losses in devices fabricated using the Low Temperature Co-fired Ceramic On Metal technique, by preventing radiation leakage and by minimizing undesired scattering. The PBSs will be embedded in the ceramic using well-developed fabrication methods. The result will be improved performance, without an increase in the manufacturing costs. Moreover, a PBS will lead to totally new applications: frequency-band controlled filters, perfect channel-drop filters, point-defect resonant cavities, linear-defect 90 degree waveguide bends, waveguide intersections with low crosstalk, and other. The new material will be employed in high-volume production items for applications such as automotive electronics, medical electronics, as well as in a variety of portable wireless communication devices.

这个小型企业创新研究第一阶段项目致力于开发一种新的微波电子材料。随着包括便携式无线设备在内的微波应用的扩展，以及随着数字集成电路速度和时钟频率增加到毫米波(MMW)范围，出现了对具有在广泛的频率和环境条件范围内一致的特性的低损耗尺寸稳定介质的需求。主要的挑战是找到一种方法，以最小的散射损耗引导毫米波辐射通过介质基板，并产生低损耗的谐振腔。Waveband公司建议开发一种新的技术，在陶瓷基板的早期制造阶段嵌入光子带隙结构(PBSS)。PBSS将通过防止辐射泄漏和最大限度地减少不必要的散射，减少使用低温共烧金属陶瓷技术制造的器件中的辐射损失。PBSS将使用成熟的制造方法嵌入陶瓷中。其结果将是在不增加制造成本的情况下提高性能。此外，PBS还将带来全新的应用：频带可控滤波器、完美的通道降滤波、点缺陷谐振腔、线缺陷90度波导弯曲、低串扰的波导交叉点等。这种新材料将用于汽车电子、医疗电子以及各种便携式无线通信设备等应用的大批量生产项目。