CAREER: MASSIVE REPLICATION OF RF/MICROWAVE MEMS PASSIVES MODULES

0093549提出了以新型射频/微波MEMS无源元件的开发及其集成到含基板电路上的方法为中心的leean集成研究和教育计划。由于对无线通信的需求不断增加，因此需要非常小的通信信道间隔，以确保在有限的带宽下增加容量。高性能无源元件是无线通信系统的关键部件。传统上，片外无源元件主要由于其高性能而用于射频/微波应用。然而，它们体积庞大，耗电量大。MEMS技术实现了传统技术无法实现的创新高性能集成射频/微波无源元件。南方唯一的同步加速器辐射源，先进微结构和器件中心位于并属于PI的机构。利用这种独特的设施，将通过LIGA和/或类似LIGA的技术开发高性能新型高纵横比射频/微波无源元件。它们包括3-D片上螺线管电感，可调谐电容器，微带线，共面波导。非常规的高纵横比微结构可以产生高质量因数、高耦合效率的无源元件和三维集成，这将在许多便携式无线通信系统应用中节省宝贵的空间。采用塑料复制技术的大规模并行无源元件转移技术将以低成本的批量生产方式将高性能RF/微波MEMS无源元件模块集成到包含衬底的电路上。晶圆级倒装芯片组装技术也将得到发展，以集成多个高性能射频/微波组件。该提案的教育部分集中在为MEMS教育开发基于网络的交互式教育材料。具体而言，将开发用于MEMS制造过程和各种MEMS传感器建模的Java小程序，并将通过互联网传播。这些教育资源将为学生学习MEMS技术提供积极的界面。还计划与其他部门的合作者一起开设高级/研究生实验班。此类课程将为学生提供LIGA和/或类似LIGA的MEMS技术的多学科应用实践设计和制造经验。与其他部门合作开发工业短期课程，为参与者提供基于liga的MEMS技术及其在RF MEMS和生物医学MEMS （BioMEMS）中的应用的第一手加工经验。在研究生和本科阶段的传统教学课程中，将广泛使用计算机辅助建模，以提高课程质量，并为学生满足当今领先的工业需求做好准备。

0093549LeeAn integrated research and education program that is centered on the development of novel RF/microwave MEMS passive components and a method of their integration onto circuit containing substrates is proposed.Since the demand for wireless communication is ever increasing, very small communication channel spacings are desirable to ensure increased capacity in limited bandwidth. High performance passive elements are key components of wireless communication systems. Traditionally, off-the-chip passive components were used for RF/microwave applications mainly due to their high performance. However, they are bulky and power consuming. MEMS technology enables innovative high performance integrated RF/microwave passive elements that were not possible by traditional technologies. South's only synchrotron radiation source, the Center for Advanced Microstructures and Devices is located and belongs to the PI's institution. Using such unique facility, high performance novel high aspect ratio RF/microwave passive components will be developed by LIGA and/or LIGA-like techniques. They include 3-D on-chip solenoid inductors, tunable capacitors, microstrip lines, coplanar waveguides. Unconventional high aspect ratio microstructures could yield high quality factor, high coupling efficiency passive components, and 3-D integration which will save precious real estate in many portable wireless communication system applications. Massively parallel passive component transfer techniques using plastic replication techniques will be developed to integrate high performance RF/microwave MEMS passive element modules onto circuit containing substrates in low cost mass production manner. Wafer-level flip-chip assembly technology will also be developed to integrate multiple numbers of high performance RF/microwave components.The educational component of the proposal is centered on the development of web-based interactive educational materials for MEMS education. Specifically, Java Applets for MEMS fabrication processes and modeling of a variety of MEMS sensors will be developed and they will be disseminated through the internet. Such educational resources will provide active interfaces for students to learn MEMS technology. Development of a senior/graduate laboratory class with collaborators in other departments is also planned. Such class will give students hands-on design and fabrication experience on LIGA and/or LIGA-like MEMS technology for multidisciplinary applications. Development of an industrial short course with collaborators in other departments is also planned to give participants first-hand processing experience on LIGA-based MEMS technology and its applications to RF MEMS and biomedical MEMS (BioMEMS). An extensive use of computer-aided modeling will be introduced to traditional instructional courses in graduate and undergraduate levels to enhance the quality of the classes and prepare the students to meet today's leading edge industrial needs.