Collaborative Research: ITR/AP - An Integrated Algorithm for Heat Conduction from Nano- to Macroscale

合作研究：ITR/AP - 从纳米到宏观热传导的集成算法

• 批准号: 0128365
• 负责人: Jonathan Freund
• 金额: $ 19.25万
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-09-01 至 2005-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0128365&HistoricalAwards=false
• 关键词: Collaborative; Research; ITR; AP; Integrated

The goal of our project is to develop a novel integrated engineering simulation tool for heat conduction in microelectronic and microphotonic components - microscale systems with nanoscale features. The global impact of this work will be to quantify, tabulate and disseminate phonon properties, which are as important for heat conduction in these devices as properties such as emissivity and extinction coefficient for thermal radiation in the classical regime. Novel molecular dynamics (MD) simulations will be used to quantify and parameterize phonon relaxation times and phonon-interface phenomena. Given the phonon data obtained through MD simulations, a new ballistic-diffusive formulation of the Boltzmann equation will enable the solution of realistically complex thermal problems from nano- to macroscales. A modular design of our implementation will facilitate an eventual integration into design software.The results from the projects will be applied for the development of Information technology systems. These are constructed from devices and components with characteristic length scales ranging from nanometers to micrometers, such as semiconductor lasers and heterojunction bipolar transistors used in telecommunication systems. Currently, the thermal design of such micro- and nanoscale components is major challenge because Fourier's law fails at these scales due to the long mean free path of phonons (the dominant heat carriers in most semiconductor devices) and there exists no practical alternative.Revised Title: ITR: Collaborative Research on the Development of an Integrated Algorithm for Heat Conduction form Nano- to Macroscale

我们的项目的目标是开发一种新型的集成工程模拟工具，用于微电子和微光子元件-具有纳米尺度特征的微尺度系统中的热传导。 这项工作的全球影响将是量化，制表和传播声子性质，这是重要的热传导在这些设备中的性能，如发射率和消光系数的热辐射在经典制度。 新的分子动力学（MD）模拟将用于量化和参数化声子弛豫时间和声子界面现象。 考虑到通过MD模拟获得的声子数据，玻尔兹曼方程的新弹道扩散公式将能够解决从纳米到宏观尺度的实际复杂的热问题。 我们采用模块化的设计，以方便最终整合到设计软件中。项目的成果将应用于信息技术系统的开发。 这些是由具有从纳米到微米的特征长度尺度的设备和组件构成的，例如用于电信系统的半导体激光器和异质结双极晶体管。 目前，这种微米和纳米级组件的热设计是主要的挑战，因为傅立叶定律在这些尺度下由于声子（大多数半导体器件中的主要热载体）的长平均自由程而失效，并且不存在实际的替代方案。 ITR：关于开发从纳米到宏观尺度的热传导集成算法的合作研究