SBIR Phase I: Electron Beam Curing of Polymer Interlayer in Silicon Carbide Joints

SBIR 第一阶段：碳化硅接头中聚合物夹层的电子束固化

• 批准号: 0232816
• 负责人: Lek Len
• 金额: $ 10万
• 依托单位: FM TECHNOLOGIES INC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-01-01 至 2003-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0232816&HistoricalAwards=false
• 关键词: SBIR; Phase; Electron; Beam; Curing

This Small Business Innovation Research Phase I project entitled " Electron BeamCuring of Polymer Interlayer in Silicon Carbide Joints" will develop the technology toenable economical commercialization of silicon carbide components. Current joining techniques are too time consuming to be economically viable for commercialization and mass production They tend to produce excessive polymer shrinkage and thus require excessive number of polymer infiltrations. The proposed pulsed electron beam curing technology will remove these obstacles bycompleting the polymer cross-linking in the microsecond time scale, which is comparableto the duration of the electron beam pulse. In this Phase I effort, the polymer shrinkagein the interlayer material will be studied first by subjecting it to electron beam irradiation.The resulting samples will be compared to those processed under conventional method,i.e., without undergoing electron beam processing. This will then be followed by theproduction of SiC joints. These joined test samples, produced with electron beam curing,will again be compared to a control joint sample. Computer simulation code will be usedto guide the experiments.Success of this project will pave the way for commercializingSiC components in many different industrial and manufacturing markets, includingpetrochemical, semiconductor, heat-treating and heat-exchanger systems, aircraft andterrestrial gas turbines, and aircraft structural components.

这一小型企业创新研究第一阶段项目名为“碳化硅接头中聚合物夹层的电子束固化”，将开发使碳化硅部件经济商业化的技术。目前的连接技术太耗时，对于商业化和大规模生产来说在经济上是不可行的。它们倾向于产生过度的聚合物收缩，因此需要过多的聚合物渗透次数。而脉冲电子束固化技术可以在微秒级的时间尺度内完成聚合物的交联，从而消除这些障碍，该时间尺度与电子束脉冲的持续时间相当。在第一阶段的工作中，将首先通过电子束辐照来研究夹层材料中的聚合物收缩。将所得样品与常规方法处理的样品进行比较，即，而不经历电子束处理。这之后将是碳化硅接头的生产。将这些用电子束固化生产的接合测试样品再次与对照接合样品进行比较。计算机模拟代码将用于指导实验。该项目的成功将为SiC组件在许多不同工业和制造市场的商业化铺平道路，包括石油化工，半导体，热处理和热交换系统，飞机和地面燃气轮机，以及飞机结构部件。