The Fifth Congress on Thermal Stresses & Related Topics

0307623为东欧的9名研究生和3名主旨演讲者提供旅行支持，以参加2003年6月在弗吉尼亚理工大学举行的关于热压力及相关话题的第五届大会。学生将根据开放的电子邮件通知和将要提交的研究进行选择。大会将讨论热应力科学和应用方面的一些主题，包括计算和分析建模。大会更广泛的影响在于许多行业中热应力的高度重要性，以及研究生参与讨论和演讲。

0307623LibrescuTravel support is provided for nine graduate students and three keynote speakers from Eastern Europe to attend the Fifth Congress on Thermal Stresses and Related Topics at Virginia Tech during June of 2003. The students will be selected based on open e-mail notifications and on the research to be presented. The congress will address a number of topics in thermal stress science and applications, including computational and analytical modeling. The broader impact of the congress lies in great importance of thermal stresses in very many industries and in the participation of graduate students in the deliberations and presentations.***