SBIR Phase I: New Class of Ultra Low Dielectric Constant Polymers for Electronic Applications

这个小型企业创新研究(SBIR)第一阶段项目计划开发一种基于聚苯撑自增强聚合物(SRP)的新型先进聚合物介电材料。具有优异的电、热和机械性能的聚合物对于各种先进的电子封装和片上应用至关重要。许多聚合物已经被提出作为解决这个问题的答案。然而，目前所有的有机介电材料都有一个致命的缺陷：它们都具有促进高介电常数和高吸湿率的极性部分。为了解决这一问题，该项目将开发一种新型的可加工、高温、极低介电、极低吸湿性和低成本的不含极性基团的介质，用于各种电子封装和层间介质应用。该项目的商业应用广泛应用于电子和芯片类型的产品。低介电常数聚合物的缺乏限制了下一代电子器件的发展。随着建筑尺寸的不断缩小，现有材料无法满足对绝缘性能的需求，因此拟议材料的出现将对该行业产生重大影响。

This Small Business Innovation Research (SBIR) Phase I project proposes to develop a new class of advanced polymeric dielectrics based on polyphenylene Self-Reinforced Polymers (SRPs). Polymers with superior electrical, thermal and mechanical performance are critical for a variety of advanced electronics packaging and on-the-chip applications. A number of polymers have been proposed as an answer to this problem. All current organic dielectrics, however, have a fatal flaw: they all feature polar moieties that promote high dielectric constants and high moisture uptake. To overcome this problem this project will develop a new type of processable, high temperature, very low dielectric, very low moisture absorbing and low cost dielectrics containing no polar groups for usage in a wide variety of electronic packaging and interlayer dielectric applications.The commercial application of this project is in the broad area of electronic and on-the-chip type products. The absence of low dielectric constant polymers is limiting the development of the next generation of electronic devices. As architectures continue to decrease in size, demands for insulative properties cannot be met by existing materials and consequently emergence of the proposed material will have a significant impact on the industry.