Student Travel for IEEE/LEOS 1st International Conference on Group IV Photonics (GFP2004); Hong Kong; Sept. 29 - Oct. 1, 2004
Student Travel for IEEE/LEOS 1st International Conference on Group IV Photonics (GFP2004); Hong Kong; Sept. 29 - Oct. 1, 2004
批准号:
0425714
负责人:
Paul Shumate
金额:
$0.5万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2004
资助国家:
美国
项目状态:
已结题
起止时间:
2004-08-01 至 2005-07-31
中文摘要
第四组光子学国际会议将于2004年9月29日至10月1日在香港举行。会议的组织包括对由C、Si、Ge、Sn二元或三元合金或元素半导体本身组成的有源区的材料和器件的新研究成果的讨论。材料结构可以采用体层或量子受限异质结构,包括量子井、线和点。欢迎关于光子带隙结构和其他纳米结构的论文。尽管会议强调的是“全四族”解决方案,但会议将接受描述硅基上三-五族和二-六族半导体结构的整体或准整体集成的论文。形式包括口头和海报会议。这次会议预计将促进研究人员之间的合作和讨论,特别是年轻专业人员和知名专家之间的合作和讨论,并确定关键的科学问题。%评估第四组光子学所涉及的基本现象的进展和状况是一个重要和及时的主题,对电子/光子学领域的进步将具有重要价值。随着评估该领域和未来方向的机会,预计大学、研究机构和行业之间将建立新的联系。申请的NSF资金将用于促进学生参与会议。***
英文摘要
An international conference on Group IV Photonics will be held September 29-October 1, 2004 in Hong Kong. The conference is organized to include discussion of new research results on materials and devices in which the active region consists of binary or ternary alloys of C, Si, Ge, Sn or of the elemental semiconductors themselves will be presented and discussed. Materials structures may employ bulk layers or quantum-confined heterostructures including quantum wells, wires, and dots. Papers on photonic-bandgap structures and other nanostructures are welcomed. Although an "all-group-IV" solution is emphasized, the conference will accept papers that describe monolithic, or quasi-monolithic, integration of group III-V and II-VI semiconductor structures upon silicon. The format includes oral and poster sessions. The conference is expected to stimulate collaboration and discussion between researchers, especially between young professionals and established experts and to identify critical scientific issues.%%%An evaluation of the progress and status of fundamental phenomena involved in Group IV Photonics is an important and timely topic, and will be of great value to progress in the electronics/photonics field. Along with the opportunity to assess the field and future directions, it is expected that new ties will be established among universities, research institutions, and industry. The requested NSF funds will be used to facilitate participation in the meeting by students. ***
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