STTR Phase I: E-Beam Automated Tape Placement Technology for High Temperature Composites

这个小型企业技术转移第一阶段项目的重点是高温树脂和胶带的开发，以及它们在原位电子束固化的自动胶带放置（ATP）制造中的应用。热塑性聚合物基体ATP和逐层电子束固化ATP （EB-ATP）被认为是实现ATP复合材料热压灭菌性能的最有前途的技术之一。在这个项目中开发的材料是全亚酰化聚酰亚胺成型粉末，具有低熔体粘度和适合高温应用的固化性能。除了材料本身，制造高质量胶带和制造复合板的工艺将在该计划的过程中开发。在先进的复合材料结构部件中，热稳定聚合物的优势在商业开发中，制造负担能力是一个重大障碍。高温、低熔体粘度聚酰亚胺与粉末束浸料和胶带的组合将在第一阶段和第二阶段的后续项目中开发，这将是一项使能技术，可以扩展长丝缠绕和ATP与电子束固化在高性能复合材料中的应用，并将填补先进复合材料行业急需的利基市场。

This Small Business Technology Transfer Phase I project focuses on the development of high temperature resins and tapes and their use in automated tape placement (ATP) fabrication with in-situ electron beam cure. Thermoplastic polymer matrix ATP and layer-by-layer electron beam curing ATP (EB-ATP) have been identified as among the most promising techniques for achieving autoclave properties in ATP composites. The materials to be developed during the course of this program are fully imidized polyimide molding powders with low melt viscosity and cured properties suitable for high-temperature applications. In addition to the materials themselves, processes for fabricating high quality tapes and for manufacturing composite plates will be developed during the course of this program. Manufacturing affordability has presented a significant barrier to the commercial exploitation of the benefits of thermally stable polymers in advanced composite structural components. The proposed combination of high temperature, low melt viscosity polyimide with powder towpreg and tape developed during this Phase I program and its Phase II follow-on will be an enabling technology for extending the use of filament winding and ATP with electron beam cure for high-performance composites and will fill a much-needed niche in the advanced composites industry.