STTR Phase II: Development of Nanostructured Solder Materials

这个小型企业技术转移(STTR)第二阶段项目将开发纳米结构增强材料，以改善锡基电子焊料合金的热机械疲劳(TMF)性能和服务可靠性。第二阶段将在模拟实际使用条件下，通过同时施加外部电、热和机械偏移来研究焊点的使用可靠性。为了开发商业上可行的产品，第二阶段将解决在制造不同形式的纳米结构焊料方面的扩大问题，以及与焊料供应商和最终用户合作，在不同焊接方法下使用这种产品制造电子元件所涉及的加工和处置问题。尝试采用无铅焊料的结果突出了采用无铅焊料组合物制造的互连的几个采用问题和对服务可靠性的担忧。在第一阶段中，证明了将表面活性和热稳定的纳米结构颗粒作为晶界增强剂以显著提高接头的机械和使用性能和可靠性的总体可行性。这一根本性发现极大地提高了对影响焊点高温使用性能和可靠性的整体工艺的了解。拟议的第二阶段项目将发展扩大生产纳米结构焊料所需的知识库，并获得在电子元件制造中实施该项目所需的技术数据库。纳米焊料增强的验证预计将在各种结构材料中具有重大的商业意义。拟议的项目代表着朝着获得与传统铅锡、共晶焊料同等性能的环保型焊料迈出了极好的一步，并可能在价值数十亿美元的全球焊料市场上带来可观的销售。

This Small Business Technology Transfer (STTR) Phase II project will develop nanostructured reinforcements to improve the thermo-mechanical fatigue (TMF) performance and service reliability of tin-based electronic solder alloys. Service reliability of solder joints will be studied under Phase II by simultaneously imposing external electrical, thermal and mechanical excursions under simulated realistic service conditions. Toward developing commercially viable products, Phase II will address scale-up issues in manufacturing different forms of nanostructured solder materials, as well as processing and disposal issues associated with the use of this product in fabrication of electronic components under different soldering methodologies, and in collaboration with solder suppliers and end users. A result of attempted adoption of lead-free solders has highlighted several adoption issues and concerns over service reliability of interconnects made with lead-free solder compositions. In Phase I, the general viability of incorporating surface active, and thermally stable nanostructured particulates as grain boundary reinforcements to significantly enhance mechanical and service performance and reliability of joints, was demonstrated. This fundamental discovery has significantly enhanced the understanding of the overall processes that affect the high temperature service performance and reliability of the solder joints. The proposed Phase II project will develop the knowledge base required for scale-up production of nanostructured solder materials and to obtain the technical data base necessary for implementation of the same in the manufacture of electronic components.The validation of nano-reinforcement of solders is expected to have significant commercial implications in a wide variety of structural materials. The proposed project represents an excellent step towards obtaining environmentally-benign solder materials with equivalent performance to traditional lead-tin, eutectic solders and which could lead to significant sales in the multi-billion dollar worldwide solder market.