STTR Phase II: Development of Nanostructured Solder Materials
STTR 第二阶段:纳米结构焊接材料的开发
基本信息
- 批准号:0521940
- 负责人:
- 金额:--
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2005
- 资助国家:美国
- 起止时间:2005-09-01 至 2008-02-29
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
This Small Business Technology Transfer (STTR) Phase II project will develop nanostructured reinforcements to improve the thermo-mechanical fatigue (TMF) performance and service reliability of tin-based electronic solder alloys. Service reliability of solder joints will be studied under Phase II by simultaneously imposing external electrical, thermal and mechanical excursions under simulated realistic service conditions. Toward developing commercially viable products, Phase II will address scale-up issues in manufacturing different forms of nanostructured solder materials, as well as processing and disposal issues associated with the use of this product in fabrication of electronic components under different soldering methodologies, and in collaboration with solder suppliers and end users. A result of attempted adoption of lead-free solders has highlighted several adoption issues and concerns over service reliability of interconnects made with lead-free solder compositions. In Phase I, the general viability of incorporating surface active, and thermally stable nanostructured particulates as grain boundary reinforcements to significantly enhance mechanical and service performance and reliability of joints, was demonstrated. This fundamental discovery has significantly enhanced the understanding of the overall processes that affect the high temperature service performance and reliability of the solder joints. The proposed Phase II project will develop the knowledge base required for scale-up production of nanostructured solder materials and to obtain the technical data base necessary for implementation of the same in the manufacture of electronic components.The validation of nano-reinforcement of solders is expected to have significant commercial implications in a wide variety of structural materials. The proposed project represents an excellent step towards obtaining environmentally-benign solder materials with equivalent performance to traditional lead-tin, eutectic solders and which could lead to significant sales in the multi-billion dollar worldwide solder market.
这个小型企业技术转移(STTR)二期项目将开发纳米结构增强材料,以改善锡基电子焊料合金的热机械疲劳(TMF)性能和使用可靠性。第二阶段将通过在模拟的实际使用条件下同时施加外部电气、热和机械偏差来研究焊点的使用可靠性。为了开发商业上可行的产品,第二阶段将解决生产不同形式的纳米结构焊料材料的规模问题,以及在不同焊接方法下使用该产品制造电子元件的处理和处置问题,并与焊料供应商和最终用户合作。尝试采用无铅焊料的结果突出了采用无铅焊料成分制成的互连的服务可靠性的几个问题和关注。在第一阶段,研究证明了将表面活性和热稳定的纳米结构颗粒作为晶界增强剂可以显著提高接头的力学性能和使用性能以及可靠性。这一基本发现大大提高了对影响焊点高温使用性能和可靠性的整个过程的理解。拟议的第二期项目将发展纳米结构焊料规模化生产所需的知识库,并获得在电子元件制造中实施所需的技术数据库。纳米增强焊料的验证有望在各种结构材料中具有重要的商业意义。该项目代表着向获得与传统铅锡共晶焊料性能相当的环保焊料材料迈出了一大步,并可能在全球焊料市场上带来数十亿美元的巨大销售额。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Joseph Lichtenhan其他文献
Joseph Lichtenhan的其他文献
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