SBIR Phase I: Low-cost Super Efficient Smart Antenna for V-band Wireless Communications

SBIR 第一阶段：用于 V 频段无线通信的低成本超高效智能天线

• 批准号: 0539736
• 负责人: Rod Waterhouse
• 金额: $ 10万
• 依托单位: Pharad LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-01-01 至 2006-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0539736&HistoricalAwards=false
• 关键词: SBIR; Phase; Low; cost; Super

This Small Business Innovation Research Phase I project will create new enabling technologies that will help advance the state-of-the-art in V-band wireless communications. They will enable the realization of cost-effective high performance Vband wireless hardware based on single radio chip solutions incorporating silicon substrates. Through the leveraging of recent advances in cost-effective CMOS processes, novel techniques will be investigated for the creation of a low cost smart antenna platform compliant with CMOS technology that can also counter the high propagation losses at V-band. Multiple Si-based printed quasi Yagi antennas will be used to feed a lens based silicon antenna to create a novel super efficient, high gain multi-beam V-band radiator. New RF interconnect technology that will allow for the efficient integration of silicon-based components with the radiating interface will also be created. The interconnect technology will be based on a new form of artificial magnetic conductor that should yield a small, low cost, highly efficient solution and ensure maximum transfer of RF power.This will advance the state-of-the-art in millimeter-wave antenna and RF interconnect technologies for next generation very high data-rate wireless communication systems. These new concepts will help accelerate the exploitation of the recently allocated 57 - 64 GHz frequency band for the deployment of new wireless communication systems that will provide a host of very high data rate services. Consumers will directly benefit through the provision of new communication services, as well as the increased affordability in acquiring un-tethered connectivity to future high capacity communications.

这个小型企业创新研究第一阶段项目将创造新的使能技术，这将有助于推动V波段无线通信的最新发展。它们将实现基于集成硅衬底的单无线电芯片解决方案的高性价比高性能Vband无线硬件。通过利用成本效益的CMOS工艺的最新进展，将研究新技术，以创建符合CMOS技术的低成本智能天线平台，该平台还可以对抗V波段的高传播损耗。多个硅基印刷准八木天线将被用来馈送一个透镜基硅天线，以创建一个新的超高效，高增益多波束V波段辐射器。新的RF互连技术将允许硅基元件与辐射接口的有效集成。该互连技术将基于一种新型的人工磁导体，该技术将产生一种小型、低成本、高效率的解决方案，并确保最大限度地传输RF功率。这将推动下一代甚高数据速率无线通信系统中最先进的毫米波天线和RF互连技术的发展。这些新的概念将有助于加速最近分配的57 - 64 GHz频带的开发，用于部署新的无线通信系统，该系统将提供大量非常高的数据速率服务。消费者将直接受益于新的通信服务的提供，以及在获得未来高容量通信的无限制连接方面的更高的可负担性。