2007 Chemistry of Supramolecules and Assemblies Gordon Conference: "Functional Materials Through Bottom-Up Self-Assembly"

通过自底向上自组装的功能材料2007年超分子和组装化学（戈登研究会议）这个国际团体旅行奖为2007年超分子和组装化学戈登研究会议提供部分支持。戈登研究会议组织管理该奖项。本次会议的主题是“自下而上组装功能材料”。本次会议将于2007年5月6日至10日在意大利巴尔加举行。今年是这一系列会议首次在国外举行。预计两年一次的系列会议将在欧洲和美国之间轮流举行，希望保持各自项目所涵盖主题的内容、出席人数和讨论。这次会议将汇集来自美国、欧盟、前苏联、中国、新加坡、澳大利亚和日本的大约135名学术、工业和政府科学家。从这个科学家团体中，大约有22个人将在40-45分钟的邀请讲座中介绍前沿研究主题，涉及超分子和组件的自下而上自组装以及由这种组装过程产生的材料和设备。这些受邀演讲之后将有15-20分钟的讨论时间。会议的科学主题将包括建筑识别、超粒子结构、纳米粒子化合物、超分子传感器、组件的电子和存储特性、用于组装的分子和聚合物改性、层接层组装、光子材料、不同长度尺度的组装、基于粒子的器件、仿生结晶、物质的新状态和粘在一起。会议将使与会者就其当前的研究成果和近期研究和发展的新方向进行交流和讨论。将讨论自下而上组装的新范例，这些新方法将解决许多重要的化学传递和界面现象。本项目提供资金以补充会议费用和/或与会议有关的差旅费。这次会议的更广泛的影响将包括为年轻科学家提供财政援助，他们将在他们即将到来的职业生涯中更加有效，因为参加了这次由自下而上的自组装和分子识别领域的世界领导人参加的会议。本次会议将为一组精选的科学家和工程师提供最前沿的教育，他们有能力将这种教育转化为新的范例、材料和工艺。国家科学基金会提供大约14%的会议总费用。

Functional Materials Through Bottom-Up Self-Assembly 2007 Chemistry of Supramolecules and Assemblies (Gordon Research Conference) This international group travel award provides partial support of the 2007 Chemistry of Supramolecules and Assemblies Gordon Research Conference. Gordon Research Conference organization administers the award. The theme of this conference is Functional Materials Through Bottom-Up Assembly. This conference will be held May 6-10, 2007 at the Il Ciocco site in Barga, Italy. This is the first year in which this series of conferences will be held abroad. It is anticipated to alternate the venue for this biennial series between Europe and the United States with the hope of keeping the content, attendance, and discussions at the frontier of the topics covered in the respective programs. The conference will bring together approximately 135 academic, industrial and government scientists from the United States, the European Union, the former Soviet Union, China, Singapore, Australia and Japan. From this body of scientists, approximately 22 individuals will present 40-45 minute invited lectures on frontier research topics addressing bottom-up self-assembly of supramolecules and assemblies as well as materials and devices created by such assembly processes. These invited lectures will then be followed by a 15-20 minute discussion period. Scientific themes of the conference will include Building Recognition, SupraParticle Architecture, Nanoparticle Compounds, Supramolecular Sensors, Electronic and Storage Properties of Assemblies, Molecular and Polymer Modification for Assembly, Layer-by-Layer Assembly, Photonic Materials, Assembly on Different Length Scales, Particle-based Devices, Biomimetic Crystallization, New States of Matter, and Sticking Things Together. The conference will effect interchange and discussion among the participants about their current research results and new directions for near term research and development. New paradigms for bottom-up assembly will be discussed, and these new approaches will address numerous significant chemical transport and interface phenomena. This project provides funds to supplement conference fees and/or travel costs associated with this meeting. The broader impact of this conference will include providing financial assistance to young scientists, who will be more effective in their forthcoming careers as a result of participating in this conference attended by worldwide leaders in bottom-up self-assembly and in molecular recognition. This conference will provide cutting edge education to a select group of scientists and engineers, well positioned to transform this education into new paradigms, materials, and processes. NSF provides approximately 14% of the total Conference cost.