2007 Chemistry of Supramolecules and Assemblies Gordon Conference: "Functional Materials Through Bottom-Up Self-Assembly"

功能材料通过自下而上的自组装2007年化学超分子和组件（戈登研究会议）这个国际团体旅行奖提供部分支持的2007年化学超分子和组件戈登研究会议。戈登研究会议组织管理该奖项。本次会议的主题是通过自底向上组装功能材料。本次会议将于2007年5月6日至10日在意大利巴尔加的Il Ciocco现场举行。这是该系列会议首次在国外举行。预计将在欧洲和美国之间交替举办这一两年一次的系列活动，希望保持各自计划所涵盖主题的内容，出席人数和讨论。来自美国、欧盟、前苏联、中国、新加坡、澳大利亚和日本的约135名学术界、工业界和政府科学家将参加这次会议。从这个科学家的身体，大约22个人将提出40-45分钟的前沿研究课题的邀请讲座，解决自下而上的超分子和组件的自组装以及材料和设备创建这样的组装过程。这些邀请讲座之后将进行15-20分钟的讨论。会议的科学主题将包括建筑识别、超粒子结构、纳米粒子化合物、超分子传感器、组装体的电子和存储性能、组装的分子和聚合物修饰、逐层组装、光子材料、不同长度尺度的组装、基于粒子的设备、仿生结晶、新物质状态和将物体粘在一起。会议将促进与会者就他们目前的研究成果和近期研究和发展的新方向进行交流和讨论。自下而上组装的新范例将被讨论，这些新方法将解决许多重要的化学运输和界面现象。该项目提供资金，以补充与本次会议有关的会议费和/或差旅费。这次会议的更广泛的影响将包括向青年科学家提供财政援助，他们将由于参加这次由世界各地自下而上自组装和分子识别领导人参加的会议而在未来的职业生涯中更加有效。本次会议将提供尖端的教育，以科学家和工程师的选择组，很好地定位，将这种教育转化为新的范式，材料和工艺。NSF提供约14%的会议总成本。

Functional Materials Through Bottom-Up Self-Assembly 2007 Chemistry of Supramolecules and Assemblies (Gordon Research Conference) This international group travel award provides partial support of the 2007 Chemistry of Supramolecules and Assemblies Gordon Research Conference. Gordon Research Conference organization administers the award. The theme of this conference is Functional Materials Through Bottom-Up Assembly. This conference will be held May 6-10, 2007 at the Il Ciocco site in Barga, Italy. This is the first year in which this series of conferences will be held abroad. It is anticipated to alternate the venue for this biennial series between Europe and the United States with the hope of keeping the content, attendance, and discussions at the frontier of the topics covered in the respective programs. The conference will bring together approximately 135 academic, industrial and government scientists from the United States, the European Union, the former Soviet Union, China, Singapore, Australia and Japan. From this body of scientists, approximately 22 individuals will present 40-45 minute invited lectures on frontier research topics addressing bottom-up self-assembly of supramolecules and assemblies as well as materials and devices created by such assembly processes. These invited lectures will then be followed by a 15-20 minute discussion period. Scientific themes of the conference will include Building Recognition, SupraParticle Architecture, Nanoparticle Compounds, Supramolecular Sensors, Electronic and Storage Properties of Assemblies, Molecular and Polymer Modification for Assembly, Layer-by-Layer Assembly, Photonic Materials, Assembly on Different Length Scales, Particle-based Devices, Biomimetic Crystallization, New States of Matter, and Sticking Things Together. The conference will effect interchange and discussion among the participants about their current research results and new directions for near term research and development. New paradigms for bottom-up assembly will be discussed, and these new approaches will address numerous significant chemical transport and interface phenomena. This project provides funds to supplement conference fees and/or travel costs associated with this meeting. The broader impact of this conference will include providing financial assistance to young scientists, who will be more effective in their forthcoming careers as a result of participating in this conference attended by worldwide leaders in bottom-up self-assembly and in molecular recognition. This conference will provide cutting edge education to a select group of scientists and engineers, well positioned to transform this education into new paradigms, materials, and processes. NSF provides approximately 14% of the total Conference cost.