Bridging the Gap Between the Industry and Academia Thermal Stresses Community: The 8th International Congress on Thermal Stresses 2009; held at U. of Illinois, June 1-4, 2009

缩小热应力界与学术界之间的差距：2009 年第八届国际热应力大会；

• 批准号: 0855492
• 负责人: Pier Marzocca
• 金额: $ 1.5万
• 依托单位: Clarkson University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-06-01 至 2009-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0855492&HistoricalAwards=false
• 关键词: Bridging; Gap; Between; Industry; Academia

AbstractThe objectives of The Eighth International Congress on Thermal Stresses (TS2009) hosted by the University of Illinois at Urbana-Champaign are to provide a forum, stimulate a scholarly dialogue, and facilitate the cross-fertilization of ideas among engineers, technologists and scientists in academia, industry and laboratories whose common interests lie in thermal stresses and related topics. All areas of Thermal Stress Sciences related to basic research and industrial applications will be represented. Keynote lectures will be delivered at the congress by prominent researchers from all over the world and topical Symposia will be organized to honor distinguished scientists. The support of the National Science Foundation will facilitate the organization of the TS2009 Congress, will provide travel funds to scientists, fellowships to talented students, and will contribute to the overall success of this planned event. The Congress encompasses topics that are not covered by other national and international conferences. The discussion of the mainstream topics as well as of the emerging areas is likely to bring about a substantial contribution in many areas of modern technology, including, primarily, the aeronautical/ aerospace, materials, nuclear, automotive, civil and mechanical engineering areas.The Congress will not only have significant value for engineering design and applications, but it will also enhance education. This event will involve a number of students and support their participation. In soliciting students to participate, women and underrepresented minorities will be strongly encouraged. The TS2009 proceedings will be the primary vehicle for dissemination of latest findings and discoveries in the thermal stresses arena.

由伊利诺伊大学香槟分校主办的第八届国际热应力大会(TS2009)的目标是提供一个论坛，促进学术对话，并促进学术界、工业界和实验室的工程师、技术人员和科学家之间的思想交流，他们的共同兴趣在于热应力及相关话题。与基础研究和工业应用相关的热应力科学的所有领域都将参加。来自世界各地的著名研究人员将在大会上发表主旨演讲，并将组织专题研讨会来表彰杰出的科学家。国家科学基金会的支持将促进TS2009大会的组织，将为科学家提供旅行资金，为有才华的学生提供奖学金，并将为这一计划中的活动的全面成功做出贡献。大会涵盖了其他国家和国际会议未涉及的议题。对主流课题和新兴领域的讨论可能会在许多现代技术领域带来重大贡献，主要包括航空航天、材料、核、汽车、土木和机械工程领域。大会不仅对工程设计和应用具有重要价值，还将促进教育。本次活动将有多名学生参与，并支持他们的参与。在邀请学生参与时，将大力鼓励妇女和代表不足的少数群体。TS2009论文集将是传播热应力领域最新发现和发现的主要工具。