SBIR Phase I: Mesoporous Nanoparticle Flame Retardants

这个小型企业创新研究第一阶段项目将研究介孔硅酸盐纳米颗粒，这些纳米颗粒专门用作结构塑料的成炭阻燃剂(FR)。与传统的阻燃剂相比，这些颗粒提供了实质性的改进，这些阻燃剂对环境有害(如卤代烃)、成本密集型(如氧化钼)、有毒(如氧化锑)、美观无吸引力(如红磷)或损害机械性能(如三水合铝和有机粘土)。该项目提供了对调节中间相在形成焦炭中的催化作用的因素的了解，包括骨架壁的组成、骨架孔结构和孔径分布、纳米颗粒的基本尺寸和形状以及聚合物基质中颗粒的负载水平。用锥形量热法测定，中间相的成炭性表现为峰值释热速率(PHHR)的降低和达到PHHR的更长时间。与其他阻燃剂不同，介孔硅酸盐纳米颗粒通过在低负载(10wt%)下提高最终复合材料的机械性能来提供附加值。在不需要有机表面改性剂的情况下，结合阻燃保护、改善的机械性能和颗粒的分散性，预示着聚合物添加剂技术的范式转变。该项目更广泛的影响/商业潜力是纳米颗粒的开发和商业化，这些纳米颗粒增强了结构聚合物材料的性能。拟议的商业化工作重点是用于真空额定电线和电缆应用以及高密度柔性电路板的FR添加剂。全球绝缘电线和电缆市场的价值超过1000亿美元，其中真空级电缆约占该市场的20%。随着新建筑需求的加速，预计这一细分市场的全球复合年增长率将达到5%。据估计，2008年美国电线电缆绝缘用聚合物的数量约为10万吨。热塑性塑料构成了最大的市场份额，聚烯烃(聚乙烯)占总数的41%。全球柔性电路板市场规模超过74亿美元，预计将以13.5%的年增长率增长，2014年将达到164亿美元。目前全球对柔性电路的年需求量约为3.9万吨。我们的纳米颗粒是已知的唯一一种在提高机械性能的同时提供更好的阻燃、减轻重量和降低渗透率的材料。聚乙烯和聚酰亚胺聚合物的这种性能组合提供了竞争优势，能够在2014年前产生3亿美元的收入。

This Small Business Innovation Research Phase I project will investigate mesoporous silicate nanoparticles specifically functionalized to act as char-forming fire retardants (FR) for structural plastics. The particles provide substantial improvements over conventional FR agents that are environmentally undesirable (e.g., halogenated hydrocarbons), cost intensive (e.g., molybdenum oxide), toxic (e.g., antimony oxide), cosmetically unattractive (e.g., red phosphorus) or that compromise mechanical properties (e.g., aluminum trihydrate and organoclays). The project provides an understanding of the factors that regulate the catalytic function of the mesophases in forming char, including the compositions of the framework walls, the framework pore structure and pore size distribution, the fundamental size and shape of the nanoparticles and the loading level of the particles in the polymer matrix. The char-forming properties of the mesophases are manifested as a reduction in the peak heat release rate (PHHR) and a longer time to reach PHHR, as determined by cone calorimetry. Unlike other FR agents, mesoporous silicates nanoparticles provide added value by enhancing the mechanical properties of the final composite at low loadings ( 10 wt%). The combination of FR protection, improved mechanical performance, and particle dispersability without the need for organic surface modifiers presage a paradigm shift in polymer additives technology.The broader impact/commercial potential of this project is the development and commercialization of nanoparticles that enhance the properties of structural polymeric materials. The proposed commercialization effort focuses on FR additives for plenum-rated wire and cable applications and high density flexible circuit boards. The global insulated wire and cable market is worth more than $100 billion with plenum-rated cable accounting for approximately 20% of that market. This segment is expected to see global growth of 5% CAGR as new construction demand accelerates. The volume of polymer used for wire and cable insulation in the US in 2008 is estimated to be ~100,000 tons. Thermoplastics constitute the largest market share with polyolefins (polyethylene) representing 41% of the total. The worldwide flexible circuit board market exceeds $7.4 billion and is expected to grow at an annual rate of 13.5%, reaching $16.4 billion in 2014. The current global annual demand for flexible circuits is ~ 39,000 tons. Our nanoparticles are the only materials known to simultaneously provide improved fire retardation, weight reduction, and decreased permeability while enhancing mechanical properties. This combination of properties for polyethylene and polyimide polymers provides a competitive advantage capable of producing $300 million in revenues by 2014.