CAREER: 3D Heterogeneous Integration for Power Reduction in Embedded Systems: Application to Wireless Image Sensing and Transport

无线图像/视频通信网络在智能摄像系统、军用和民用监控、绿色建筑、沉浸式计算、生物遥测和自主机器人/车辆等应用中迅速普及。用于多媒体传感和通信的低功耗嵌入式系统是其有效部署的必要条件。本研究探讨了在服务质量（QoS）约束下，实时成像、大容量多媒体处理和时变噪声信道中无线通信的嵌入式系统功耗最小化的原理。在3d集成电路（IC）中探索图像传感器，存储器，数字和射频的异构集成以实现这一目标。研究了3D异构集成电路中组件、算法和环境的功能和物理相互作用，以创建系统设计、物理分析和实时控制原则，以降低功耗。将这些原理应用于高质量图像/视频通信网络的低功耗3D无线图像传感器节点的设计。该项目的教学计划包括创建新的本科课程“计算物理”、可视化VLSI学习工具、本科课程“玩具传感器”芯片设计项目；培养本科生的研究。该计划开发了教学方法和工具，为下一代学生提供VLSI的综合学习，而不是孤立的设备，电路和系统技能。外展活动包括参与佐治亚理工学院的夏季本科生工程/科学研究项目；通过促进非裔美国学生工程和科学学术事业项目招收代表性不足的学生；参加乔治亚州第一届中学生乐高联盟，由乔治亚理工学院ECE主办。

Wireless image/video communication networks are proliferating rapidly in applications like smart camera systems, military and civilian surveillance, green buildings, immersive computing, bio-telemetry, and autonomous robots/vehicles. Low-power embedded systems for multimedia sensing and communication are essential for their effective deployment. This research explores principles to minimize power dissipation of embedded systems for real-time imaging, high-volume multimedia processing, and wireless communication in time-varying noisy channel under Quality-of-Service (QoS) constraints. The heterogeneous integration of image sensor, memory, digital, and RF in a 3D-integrated circuit (IC) is explored to achieve this goal. The functional and physical interactions of components, algorithms, and environment in the 3D heterogeneous IC is investigated to create system design, physical analysis, and real-time control principles for power reduction. The principles are applied to design a low-power 3D wireless image sensor node for high-quality image/video communication network. The educational plan of the project includes creating a new undergraduate course, "Physics of Computation", a visual VLSI learning tool, and a "toy-sensor" chip design project for undergraduate courses; and fostering undergraduate research. This plan develops the pedagogical methods and tools for delivering an integrative learning of VLSI, instead of isolated skills in device, circuits, and systems, to next generation students. The outreach activities include engagement with the Summer Undergraduate Research in Engineering/Science program at Georgia Tech; recruiting under-represented students through the Facilitating Academic Careers in Engineering and Science for African-American students program; and participation in the First Lego League for the middle school students in the State of Georgia, hosted by ECE, Georgia Tech.