CAREER: Leveraging Three-Dimensional Integration Technology for Highly Heterogeneous Systems-on-Chip

异质三维(3D)集成是一种以较低成本开发多功能系统的新兴范例。占主导地位的实践主要针对具有有限异构性的高性能应用程序，例如逻辑上逻辑和逻辑上存储器集成。相反，这一提议体现了一种显著不同的愿景，其中重点是低功耗、高度异质的3D系统片上系统(SoCs)，该系统在生命科学、高能效移动计算和环境控制方面具有广阔的应用前景。尽管最近在开发混合3D IC方面做出了越来越多的努力，但系统的设计和分析框架尚未存在。这项研究通过解决对该框架至关重要的三个相互关联的问题来满足这一需求：系统范围的功率、信号和检测完整性。在紧密耦合的3D SoC中，同时满足这三个设计目标是一个巨大的挑战。通过将多个平面视为单个实体，将开发新的电路和物理级设计和分析方法来缓解这一根本挑战。对信号完整性的传统理解将扩展到考虑传感完整性，这是异质3D SoC中的一个重要问题，其中多个传感器和传感电子设备是协调的。所提出的方法将通过开发和制造应用于生物电子学的异质3D测试芯片来进行评估。3D集成和异质SoC之间的协同作用为集成电子学提供了一个改变范式的愿景，对科学、工业和整个社会都有很大的好处。在传统扩展的基本极限即将到来之际，这种协同效应为包括More-More系统在内的各种应用带来了新的机遇。拟议的研究通过瞄准关键的电路和物理层面的问题，增强了这种合作的可行性。这些研究活动将与中学、本科生和研究生层面的教育倡议紧密结合，少数群体和代表性不足的群体将参与其中。这些努力将既包括传统活动(如引入新课程和促进本科生研究)，也包括与最近的教学实践互动的新方法。国际和平协会还将继续参加部门和地方的外联活动，如工程学夏令营和科学博览会，这两个活动的对象都是包括长岛在内的大纽约市地区的高中生。这项提议的相互交织的目标将保证混合3D SoC中的功率、信号和传感完整性，同时为科学进步和教育多样性做出贡献。

Heterogeneous three-dimensional (3D) integration is an emerging paradigm for developing multifunctional systems at a lower cost. The dominant practice targets primarily high performance applications with limited heterogeneity such as logic-on-logic and memory-on-logic integration. On the contrary, this proposal embodies a significantly different vision, in which the focus is on low power highly heterogeneous 3D systems-on-chip (SoCs) with promising applications to the life sciences, energy efficient mobile computing, and environmental control. Despite the recent and growing efforts to develop hybrid 3D ICs, a systematic design and analysis framework does not yet exist. This research fills this need by addressing three interrelated issues of critical importance to this framework: system-wide power, signal, and sensing integrity. Simultaneously satisfying these three design objectives is a significant challenge in tightly coupled 3D SoCs. By considering multiple planes as a single entity, novel circuit- and physical-level design and analysis methodologies will be developed to alleviate this fundamental challenge. The traditional understanding of signal integrity will be extended to consider sensing integrity, an important issue in heterogeneous 3D SoCs, where multiple sensors and sensing electronics are coordinated. The proposed methodologies will be evaluated by developing and fabricating a heterogeneous 3D test chip with application to bio-electronics.The synergy between 3D integration and heterogeneous SoCs provides a paradigm changing vision for integrated electronics with substantial benefits to science, industry, and society at large. At a time when the fundamental limits of traditional scaling are approaching, this synergy brings new opportunities to a variety of applications including More-than-Moore systems. The proposed research enhances the feasibility of this cooperation by targeting critical circuit- and physical-level issues. These research activities will be tightly integrated with educational initiatives at the secondary, undergraduate, and graduate levels with participation from minority and underrepresented groups. These efforts will include both traditional activities (such as introducing new courses and promoting undergraduate research) and novel methods that interact with recent pedagogical practices. The PI will also continue to participate in the departmental and local outreach activities such as an engineering summer camp and a science fair, both targeting high school students within the greater New York City area including Long Island. The intertwined objectives of this proposal will guarantee power, signal, and sensing integrity in hybrid 3D SoCs, while contributing toward the advancement of science and diversity in education.