CAREER: Leveraging Three-Dimensional Integration Technology for Highly Heterogeneous Systems-on-Chip

异构三维（3D）集成是一种以较低成本开发多功能系统的新兴范例。主流实践主要针对具有有限异构性的高性能应用程序，例如逻辑对逻辑和内存对逻辑的集成。相反，该提案体现了一个明显不同的愿景，其中重点是低功耗、高异构的3D片上系统（soc），在生命科学、节能移动计算和环境控制方面具有广阔的应用前景。尽管最近越来越多的人致力于开发混合3D集成电路，但目前还没有一个系统的设计和分析框架。本研究通过解决对该框架至关重要的三个相互关联的问题来填补这一需求：系统范围的功率，信号和传感完整性。同时满足这三个设计目标是紧耦合3D soc的重大挑战。通过将多个平面视为单个实体，将开发新的电路和物理级设计和分析方法来减轻这一基本挑战。对信号完整性的传统理解将扩展到考虑传感完整性，这是异构3D soc中的一个重要问题，其中多个传感器和传感电子设备是协调的。提出的方法将通过开发和制造应用于生物电子学的异质3D测试芯片来评估。3D集成和异构soc之间的协同作用为集成电子学提供了一个改变范式的愿景，对科学、工业和整个社会都有实质性的好处。当传统扩展的基本限制正在接近时，这种协同作用为包括More-than-Moore系统在内的各种应用带来了新的机会。提出的研究通过针对关键电路和物理层面的问题来增强这种合作的可行性。这些研究活动将与中学、本科和研究生阶段的教育活动紧密结合，并由少数民族和代表性不足的群体参与。这些努力将包括传统活动（如引进新课程和促进本科生研究）和与最近的教学实践相互作用的新方法。PI还将继续参与部门和地方外展活动，如工程夏令营和科学博览会，这些活动都针对包括长岛在内的大纽约地区的高中生。该提案的相互交织的目标将保证混合3D soc的功率，信号和传感完整性，同时为科学和教育多样性的进步做出贡献。

Heterogeneous three-dimensional (3D) integration is an emerging paradigm for developing multifunctional systems at a lower cost. The dominant practice targets primarily high performance applications with limited heterogeneity such as logic-on-logic and memory-on-logic integration. On the contrary, this proposal embodies a significantly different vision, in which the focus is on low power highly heterogeneous 3D systems-on-chip (SoCs) with promising applications to the life sciences, energy efficient mobile computing, and environmental control. Despite the recent and growing efforts to develop hybrid 3D ICs, a systematic design and analysis framework does not yet exist. This research fills this need by addressing three interrelated issues of critical importance to this framework: system-wide power, signal, and sensing integrity. Simultaneously satisfying these three design objectives is a significant challenge in tightly coupled 3D SoCs. By considering multiple planes as a single entity, novel circuit- and physical-level design and analysis methodologies will be developed to alleviate this fundamental challenge. The traditional understanding of signal integrity will be extended to consider sensing integrity, an important issue in heterogeneous 3D SoCs, where multiple sensors and sensing electronics are coordinated. The proposed methodologies will be evaluated by developing and fabricating a heterogeneous 3D test chip with application to bio-electronics.The synergy between 3D integration and heterogeneous SoCs provides a paradigm changing vision for integrated electronics with substantial benefits to science, industry, and society at large. At a time when the fundamental limits of traditional scaling are approaching, this synergy brings new opportunities to a variety of applications including More-than-Moore systems. The proposed research enhances the feasibility of this cooperation by targeting critical circuit- and physical-level issues. These research activities will be tightly integrated with educational initiatives at the secondary, undergraduate, and graduate levels with participation from minority and underrepresented groups. These efforts will include both traditional activities (such as introducing new courses and promoting undergraduate research) and novel methods that interact with recent pedagogical practices. The PI will also continue to participate in the departmental and local outreach activities such as an engineering summer camp and a science fair, both targeting high school students within the greater New York City area including Long Island. The intertwined objectives of this proposal will guarantee power, signal, and sensing integrity in hybrid 3D SoCs, while contributing toward the advancement of science and diversity in education.