CAREER: Leveraging Three-Dimensional Integration Technology for Highly Heterogeneous Systems-on-Chip

异构三维（3D）集成是一种新兴的模式，以开发多功能系统，以较低的成本。主要的实践主要针对具有有限异构性的高性能应用，例如逻辑上逻辑和存储器上逻辑集成。相反，该提案体现了一个显著不同的愿景，其中重点是低功耗高度异构的3D片上系统（SoC），具有生命科学，节能移动的计算和环境控制的应用前景。尽管最近和越来越多的努力来开发混合3D IC，一个系统的设计和分析框架还不存在。这项研究填补了这一需求，解决三个相互关联的问题，至关重要的是这个框架：系统范围内的电源，信号和传感完整性。同时满足这三个设计目标是紧密耦合的3D SoC中的一个重大挑战。通过将多个平面视为单个实体，将开发新的电路和物理级设计和分析方法来缓解这一根本挑战。对信号完整性的传统理解将扩展到考虑传感完整性，这是异构3D SoC中的一个重要问题，其中多个传感器和传感电子器件相互协调。所提出的方法将通过开发和制造一个异构的3D测试芯片与生物electronics.3D集成和异构的SoC之间的协同作用提供了一个集成电子与科学，工业和社会的实质性利益的范式变化的愿景进行评估。在传统缩放的基本限制正在接近的时候，这种协同效应为包括摩尔摩尔系统在内的各种应用带来了新的机会。拟议的研究通过针对关键电路和物理层面的问题，提高了这种合作的可行性。这些研究活动将与中学，本科和研究生教育举措紧密结合，并有少数民族和代表性不足的群体参与。这些努力将包括传统活动（如引入新课程和促进本科生研究）和与最近的教学实践互动的新方法。PI还将继续参与部门和当地的外展活动，如工程夏令营和科学博览会，这两项活动都针对大纽约市地区（包括长岛）的高中生。该提案的相互交织的目标将保证混合3D SoC中的电源、信号和传感完整性，同时有助于促进科学和教育的多样性。

Heterogeneous three-dimensional (3D) integration is an emerging paradigm for developing multifunctional systems at a lower cost. The dominant practice targets primarily high performance applications with limited heterogeneity such as logic-on-logic and memory-on-logic integration. On the contrary, this proposal embodies a significantly different vision, in which the focus is on low power highly heterogeneous 3D systems-on-chip (SoCs) with promising applications to the life sciences, energy efficient mobile computing, and environmental control. Despite the recent and growing efforts to develop hybrid 3D ICs, a systematic design and analysis framework does not yet exist. This research fills this need by addressing three interrelated issues of critical importance to this framework: system-wide power, signal, and sensing integrity. Simultaneously satisfying these three design objectives is a significant challenge in tightly coupled 3D SoCs. By considering multiple planes as a single entity, novel circuit- and physical-level design and analysis methodologies will be developed to alleviate this fundamental challenge. The traditional understanding of signal integrity will be extended to consider sensing integrity, an important issue in heterogeneous 3D SoCs, where multiple sensors and sensing electronics are coordinated. The proposed methodologies will be evaluated by developing and fabricating a heterogeneous 3D test chip with application to bio-electronics.The synergy between 3D integration and heterogeneous SoCs provides a paradigm changing vision for integrated electronics with substantial benefits to science, industry, and society at large. At a time when the fundamental limits of traditional scaling are approaching, this synergy brings new opportunities to a variety of applications including More-than-Moore systems. The proposed research enhances the feasibility of this cooperation by targeting critical circuit- and physical-level issues. These research activities will be tightly integrated with educational initiatives at the secondary, undergraduate, and graduate levels with participation from minority and underrepresented groups. These efforts will include both traditional activities (such as introducing new courses and promoting undergraduate research) and novel methods that interact with recent pedagogical practices. The PI will also continue to participate in the departmental and local outreach activities such as an engineering summer camp and a science fair, both targeting high school students within the greater New York City area including Long Island. The intertwined objectives of this proposal will guarantee power, signal, and sensing integrity in hybrid 3D SoCs, while contributing toward the advancement of science and diversity in education.