SBIR Phase I: Reactive Silver Inks for High Performance Printed Electronics

该项目的更广泛的影响/商业影响集中在其显著增强导电油墨在印刷电子市场应用的能力上。印刷电子是由高粘度银浆料丝网印刷应用为主。然而，这些浆料成本极高，需要很高的退火温度，并且不能达到其金属含量的高导电性。Electroninks吗?无颗粒银浆料开启了使用低银重量百分比浆料的可能性，这种浆料可以在低温下实现高导电性，从而在印刷电子产品中实现一系列新的应用。这个小企业创新研究（SBIR）第一阶段项目将专注于优化新型银油墨配方，该配方具有低银重量百分比（10-20%），在与低成本基材（150ºC）兼容的温度下，比目前的银糊（5-10%）具有更高的导电性（50-90%的散装银）。电子墨水将专注于新的银前驱体化学，允许完全凝胶化，否则低粘度油墨用于丝网印刷应用。

The broader impact/commercial impact of this project is centered on its ability to significantly enhance the conductive ink applications in the printed electronics market. Printed electronics is dominated by high viscosity silver pastes for screen-printing applications. However, these pastes are extremely high cost, require high annealing temperatures, and do not achieve the high conductivities with its metal content. Electroninks? particle-free silver pastes open the possibility of using of a low silver weight percentage paste that can achieve high conductivities at low temperatures enabling a range of new applications in printed electronics. This Small Business Innovative Research (SBIR) Phase I project will focus on optimizing novel silver ink formulations that have a low weight percentage of silver (10-20%) that achieve much higher conductivity (50-90% of bulk silver) than current silver pastes (5-10% of bulk silver) at temperatures that are compatible with low-cost substrates (150ºC). Electroninks will focus on novel silver precursor chemistries that allow full gelation of otherwise low-viscosity inks for screen-printing applications.