Multiphysical circuit design based on microacoustic RF-MEMS components

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The results on the modeling and compensation of the non ideal behavior of the BAW-MEMS components obtained during phase 1provide the main input for the extension of the multiphysics (electromagnetic acoustic thermal) modeling approach and theoptimization of the micro acoustic MEMS-components on the radio system hierarchy level for phase 2. The parameterized multiphysicalbehavior models for the BAW MEMS components will be extended by the self-heating and nonlinear (X-parameters model) domains in close cooperation with TP-B3. That will enable the optimization of not just the small but also of the large signal behavior on the radio system's hierarchy level. In that way the tradeoffs between the power durability considerations of the radio system at the large signal levels, the effort for the development of new deposition processes required for the implementation of the different temperature and nonlinearity compensation methods, the thereby caused degradation of the small signal performance or the optimization of further radio system components will become feasible. For that step also the extension of the BAW MEMS library by BAW components with optimized linear behavior becomes necessary. The optimized BAW components should be applied within the high power TX path of the MUSIK demonstrator and manufactured by TP-C1 and TP-C2 on the SiCer monolithic substrate.