STTR Phase I: Spatially controlled direct transfer printing of semiconductor components for high-performance flexible electronic devices

STTR第一阶段：用于高性能柔性电子设备的半导体元件的空间控制直接转移印刷

• 批准号: 1521450
• 负责人: David Grierson
• 金额: $ 22.5万
• 依托单位: SysteMECH, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2015
• 资助国家: 美国
• 起止时间: 2015-07-01 至 2016-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1521450&HistoricalAwards=false
• 关键词: STTR; Phase; Spatially; controlled; direct

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I is the development of a disruptive manufacturing technology that will enable a new class of nanomembrane-based electronic devices to be assembled and integrated on flexible substrates. This innovative technology promises to provide flexible electronics developers and manufacturers a new option for fabricating a wide range of flexible devices that require the integration of high-performance semiconductors. It is anticipated that printing tools and processes based on this core technology will significantly lower the technological barriers that are hindering the widespread manufacture of next-generation flexible devices.This Small Business Innovation Research (SBIR) Phase I project aims to develop a direct printing tool that surpasses the available technologies in terms of both precision and scalability. Current flexible device manufacturing processes do not have the capabilities needed to realize high-performance flexible devices through the integration of high-quality semiconductor materials. Therefore, new strategies are required for fabricating and printing the thin device layers that are essential in emerging high-performance flexible electronics. This project will involve mechanics simulations,tool design and fabrication, process experiments to meet resolution and yield metrics, and establishment of design constraints and operating conditions for a manufacturing process.

这一小企业创新研究（SBIR）第一阶段的更广泛的影响/商业潜力是开发一种颠覆性的制造技术，该技术将使一类新的基于纳米膜的电子设备能够在柔性基板上组装和集成。这项创新技术有望为柔性电子开发商和制造商提供一种新的选择，用于制造各种需要集成高性能半导体的柔性设备。预计基于该核心技术的打印工具和工艺将大大降低阻碍下一代柔性设备广泛制造的技术障碍。该小型企业创新研究（SBIR）第一期项目旨在开发一种在精度和可扩展性方面超越现有技术的直接打印工具。目前的柔性器件制造工艺不具有通过集成高质量半导体材料来实现高性能柔性器件所需的能力。因此，需要新的策略来制造和印刷在新兴的高性能柔性电子产品中必不可少的薄器件层。该项目将涉及力学模拟，工具设计和制造，工艺实验，以满足分辨率和产量指标，并建立设计约束和制造过程的操作条件。