CI-NEW: Collaborative Research: Developing a Community Infrastructure for Reliability-Aware Cross-Layered Design of Integrated Circuits
CI-NEW:协作研究:为集成电路的可靠性感知跨层设计开发社区基础设施
基本信息
- 批准号:1629839
- 负责人:
- 金额:$ 25万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2016
- 资助国家:美国
- 起止时间:2016-09-01 至 2020-08-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Reliability analysis of integrated circuits (ICs) has become a greater concern in the development of computing systems. Technology scaling offers more transistors to enable system-on-a-chip (SoC) integration, but it also means more transistors that can be affected by radiation-induced faults. Designers must consider how those faults impact the entire computing system by including levels of abstraction in both hardware and software. Reliability cannot be addressed by considering the device, circuit, architecture, or application layer individually. Cross-layered modeling and simulation enables a better understanding of the complex interactions among particle physics, fabrication technology, processor architecture, and the software stack in order to develop reliable computing systems. With the increase in cost and time of the system design process, pre-fabrication modeling of radiation effects has become a critical field of research. By understanding these processes, designers can meet traditional constraints of performance and power, while addressing concerns for the soft error rate (SER). Potential application domains include, but are not limited to, automotive embedded systems, high-performance computing, and spaceborne environments. This project creates a research infrastructure that links soft error simulations at the device, circuit, architecture, and application levels. This infrastructure provides a testbed for characterizing the resilience of algorithms for computer and computational sciences. It also contains testbeds for evaluating the reliability of the architecture and the design of computing systems. By providing up-to-date models of the effects of single events on current and future technologies, it facilitates the development of computing models and technologies based on emerging scientific ideas from the research community. The infrastructure will be accessible to a larger research community through web-based content (e.g., online tutorials and webinars) and interactive workshops at conferences and symposia. This project broadens the participation of groups traditionally underrepresented in the areas of science, technology, engineering, and mathematics (STEM) through outreach to encourage students to enter the science and engineering fields. The STEM Scholars Program at North Carolina A&T provides a computing skills workshop to African-American high school students.
集成电路(IC)的可靠性分析已经成为计算系统发展中的一个更加关注的问题。技术扩展提供了更多的晶体管来实现片上系统(SoC)集成,但这也意味着更多的晶体管可能会受到辐射感应故障的影响。设计人员必须考虑这些故障如何通过在硬件和软件中包含抽象级别来影响整个计算系统。可靠性不能通过单独考虑设备、电路、架构或应用层来解决。跨层建模和仿真使人们能够更好地了解粒子物理、制造技术、处理器体系结构和软件堆栈之间的复杂相互作用,以便开发可靠的计算系统。随着系统设计过程中成本和时间的增加,辐射效应的预制建模成了一个关键的研究领域。通过了解这些过程,设计人员可以满足传统的性能和功率限制,同时解决对软错误率(SER)的担忧。潜在的应用领域包括但不限于汽车嵌入式系统、高性能计算和星载环境。该项目创建了一个研究基础设施,将设备、电路、体系结构和应用级别的软错误模拟联系起来。这一基础设施为描述计算机和计算科学算法的弹性提供了试验台。它还包括用于评估体系结构和计算系统设计可靠性的试验台。通过提供单个事件对当前和未来技术的影响的最新模型,它促进了基于研究界新出现的科学思想的计算模型和技术的开发。更大的研究界将可以通过网上内容(例如,在线教程和网上研讨会)以及在会议和专题讨论会上举办的互动讲习班来使用该基础设施。该项目通过鼓励学生进入科学和工程领域,扩大了传统上在科学、技术、工程和数学(STEM)领域中代表性不足的群体的参与。北卡罗来纳州A&A;T的STEM学者项目为非裔美国高中生提供计算机技能研讨会。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Daniel Limbrick其他文献
Athena - The NSF AI Institute for Edge Computing
Athena - NSF AI 边缘计算研究所
- DOI:
- 发表时间:
2024 - 期刊:
- 影响因子:0
- 作者:
Yiran Chen;Suman Banerjee;S. Daily;Jeffery Krolik;Hai (Helen) Li;Daniel Limbrick;Miroslav Pajic;Rajashi Runton;Lin Zhong - 通讯作者:
Lin Zhong
Daniel Limbrick的其他文献
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{{ truncateString('Daniel Limbrick', 18)}}的其他基金
Excellence in Research: Collaborative Research: Real-time Fault Diagnosis for Self-Driving Vehicles
卓越研究:协作研究:自动驾驶车辆的实时故障诊断
- 批准号:
2000320 - 财政年份:2020
- 资助金额:
$ 25万 - 项目类别:
Standard Grant
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