I-Corps: 6Sensing: Chip-scale Raman sensors
I-Corps:6Sensing:芯片级拉曼传感器
基本信息
- 批准号:1851293
- 负责人:
- 金额:$ 5万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2018
- 资助国家:美国
- 起止时间:2018-11-15 至 2020-04-30
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The broader impact/commercial potential of this I-Corps project is to provide on-chip optical sensors that enable faster and cheaper production of drugs and chemicals. Pharmaceutical R&D and production rely heavily on chemical analysis to provide insight into the processes at play, however analytical instruments do not follow the latest manufacturing trends towards single-use technologies and smaller batches, or even continuous production. Integrated (on-chip) photonics is an attractive sensing platform thanks to its small form factor, robustness, large multiplexing capability, and tight optical confinement that enhances light-matter interactions. This project will pioneer the large-scale use of integrated photonic sensors starting with chemical sensing, paving the way to other applications. By enabling a better understanding of the reactions at play in manufacturing processes, the proposed technology is poised to impact the pharmaceutical market and help improving public health.This I-Corps project aims to develop the first practical implementation of a microchip-scale optical spectrometer. Integrated photonic product remain scarce due to several barriers at the fabrication and packaging levels. This project will mitigate these issues to offer equivalent sensitivity and performance to large benchtop optical spectrometers in a dramatically smaller form factor. This will be realized by combining recent advances in integrated photonic component design, photonic chip architecture, and optical packaging. The proposed sensor will enable novel chemical sensing applications and help with the understanding of processes at play in areas such as cell-based manufacturing and continuous-flow chemical manufacturing.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
这个I-Corps项目的更广泛的影响/商业潜力是提供芯片上的光学传感器,使药物和化学品的生产更快,更便宜。药品研发和生产严重依赖化学分析来深入了解所用工艺,但分析仪器并没有遵循一次性技术和小批量甚至连续生产的最新制造趋势。集成(片上)光子学是一种有吸引力的传感平台,这要归功于其小的形状因子、鲁棒性、大的多路复用能力和增强光-物质相互作用的紧密光学限制。该项目将开创从化学传感开始大规模使用集成光子传感器的先河,为其他应用铺平道路。通过更好地了解制造过程中的反应,该技术有望影响制药市场,并有助于改善公共健康。该I-Corps项目旨在开发第一个实际应用的微芯片级光谱仪。由于制造和封装层面的几个障碍,集成光子产品仍然稀缺。该项目将缓解这些问题,以更小的外形尺寸提供与大型台式光谱仪同等的灵敏度和性能。这将通过结合集成光子元件设计,光子芯片架构和光学封装的最新进展来实现。拟议的传感器将使新的化学传感应用,并有助于理解在发挥作用的过程中,如细胞为基础的制造和连续流化学manufacturing.This奖项反映了NSF的法定使命,并已被认为是值得通过评估使用基金会的智力价值和更广泛的影响审查标准的支持。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Juejun Hu其他文献
A substrate-blind platform for photonic integration
用于光子集成的盲基板平台
- DOI:
10.1117/2.1201410.005643 - 发表时间:
2014 - 期刊:
- 影响因子:0
- 作者:
Juejun Hu - 通讯作者:
Juejun Hu
Integration of Free-Form Micro-Optics with PICs for Sensing, Packaging, and Optical Manipulation
自由曲面微光学器件与 PIC 的集成,用于传感、封装和光学操作
- DOI:
- 发表时间:
2022 - 期刊:
- 影响因子:0
- 作者:
Luigi Ranno;Shaoliang Yu;Qingyang Du;Samuel Serna;C. McDonough;Nicholas M. Fahrenkopf;T. Gu;Juejun Hu - 通讯作者:
Juejun Hu
Packaging strategies for 3D integration of Photonic and Electronic chips on a Glass substrate
玻璃基板上光子和电子芯片 3D 集成的封装策略
- DOI:
- 发表时间:
2023 - 期刊:
- 影响因子:0
- 作者:
R. Bernson;Saif Wakeel;Parnika Gupta;Luigi Ranno;Drew Weninger;Anuradha Agarwal;Samuel Serna;Juejun Hu;K. Gradkowski;Lionel Kimerling;Peter O’Brien - 通讯作者:
Peter O’Brien
Invited) Mechanically Flexible Integrated Photonic Systems for Sensing and Communications
特邀)用于传感和通信的机械柔性集成光子系统
- DOI:
- 发表时间:
2017 - 期刊:
- 影响因子:0
- 作者:
Lan Li;Hongtao Lin;Jérôme Michon;S. Geiger;Junying Li;Hanyu Zheng;Yizhong Huang;A. Yadav;K. Richardson;T. Gu;Juejun Hu - 通讯作者:
Juejun Hu
Photonic Tensor Core with Photonic Compute-in-Memory
具有光子内存计算功能的光子张量核心
- DOI:
10.1364/ofc.2022.m2e.4 - 发表时间:
2022 - 期刊:
- 影响因子:0
- 作者:
Xiaoxuan Ma;Jiawei Meng;N. Peserico;M. Miscuglio;Yifei Zhang;Juejun Hu;V. Sorger - 通讯作者:
V. Sorger
Juejun Hu的其他文献
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{{ truncateString('Juejun Hu', 18)}}的其他基金
Collaborative Research: FuSe:Substrate-inverted Multi-Material Integration Technology
合作研究:FuSe:衬底倒置多材料集成技术
- 批准号:
2328839 - 财政年份:2023
- 资助金额:
$ 5万 - 项目类别:
Continuing Grant
Collaborative Research: FuSe: High-throughput Discovery of Phase Change Materials for Co-designed Electronic and Optical Computational Devices (PHACEO)
合作研究:FuSe:用于共同设计的电子和光学计算设备的相变材料的高通量发现(PHACEO)
- 批准号:
2329088 - 财政年份:2023
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Combinatorial solution processing of optical phase change materials
合作研究:光学相变材料的组合溶液加工
- 批准号:
2225968 - 财政年份:2022
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
PFI-RP: A high-performance, low-cost chip-scale platform for medical imaging
PFI-RP:用于医学成像的高性能、低成本芯片级平台
- 批准号:
2122581 - 财政年份:2021
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
ASCENT: PROWESS: Phase-change Reconfigurable Optical WavEfront Synthesis System
ASCENT:PROWESS:相变可重构光波前合成系统
- 批准号:
2132929 - 财政年份:2021
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Tellurene mid-infrared integrated photonics
合作研究:碲烯中红外集成光子学
- 批准号:
2023987 - 财政年份:2020
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Conformal and robust integrated infrared spectroscopic sensors
合作研究:共形且坚固的集成红外光谱传感器
- 批准号:
1709212 - 财政年份:2017
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
CAREER: Glass-Based Fexible Integrated Photonic Devices
职业:玻璃基柔性集成光子器件
- 批准号:
1453218 - 财政年份:2015
- 资助金额:
$ 5万 - 项目类别:
Standard Grant
Collaborative Research: Thin-Film Chalcogenide Glass Materials for High-Quality Integrated Photonics
合作研究:用于高质量集成光子学的薄膜硫系玻璃材料
- 批准号:
1506605 - 财政年份:2015
- 资助金额:
$ 5万 - 项目类别:
Continuing Grant
Workshop -- Support to Students to Attend IEEE Photonics Society Summer Topical Conferences, Montreal, July 14-16, 2014
研讨会——支持学生参加 IEEE 光子学协会夏季专题会议,蒙特利尔,2014 年 7 月 14 日至 16 日
- 批准号:
1439933 - 财政年份:2014
- 资助金额:
$ 5万 - 项目类别:
Standard Grant














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