Collaborative Research: SHF: Small: Tangram: Scaling into the Exascale Era with Reconfigurable Aggregated "Virtual Chips"

合作研究：SHF：小型：七巧板：通过可重构聚合“虚拟芯片”扩展到百亿亿次时代

• 批准号: 2124525
• 负责人: Bayaner Arigong
• 金额: $ 10.8万
• 依托单位: Florida Agricultural and Mechanical University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-01-01 至 2024-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2124525&HistoricalAwards=false
• 关键词: Collaborative; Research; SHF; Small; Tangram

The design of general-purpose processors is reaching a performance bottleneck due to the limitations in technology scaling. Chiplet-based systems offer a promising solution by integrating small dies (chiplets) inside one package. Chiplets also enable heterogeneous integration of discrete chip architectures, such as CPUs, GPUs, DSPs, and FPGAs. However, the design of high-performance chiplet-based systems faces serious challenges: inter-chiplet communication is a critical bottleneck; resource needs to be efficiently shared among the chiplets to improve the performance-cost ratio; power and thermal management need to be optimized for better in-package integration. Consequently, such designs need to take a more holistic approach, and investigations are needed on the cross-cutting issues across the processing nodes, storage and interconnection fabric. This research proposes to build "virtual chips" from heterogeneous aggregated chiplets, so that the system can not only reap the performance benefit of a monolithic super chip but also break the scalability bottleneck. A major outcome of the project will be a set of optimization methods that enable the design of a reconfigurable architecture, leveraging a hybrid wireless interconnection to seamlessly connect the computing and memory components. To this end, the research goals include: (1) design of reconfigurable architectures to break the chiplet boundaries for efficient resource sharing; (2) development of models to quantify interactions between the applications and hardware resources for fast design-space exploration; (3) design of a hybrid wireless interconnection network to seamlessly bridge the physical gaps between chiplets and enable reconfigurable architectures through the flexibility of wireless networks; and (4) design of novel wireless antennas to improve energy and thermal efficiency.The proposed research bridges the gap between multiple layers of the design stack: hardware architectures, networks and devices. Due to its cross-cutting nature, the proposed research has the potential to transform the design of high-performance, energy-efficient and cost-effective systems that are able to meet the demand of emerging applications with growing bandwidth and performance needs. The educational contributions of this research include integrating research with teaching and training, design of tutorials and workshops focusing on the training of future engineers, and interaction with industry to accelerate technology transfer. Through the outreach activities as part of the proposed project, more undergraduate and minority students will be attracted to this field of engineering.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

由于技术扩展的局限性，通用处理器的设计正在达到性能瓶颈。基于Chiplet的系统通过将小模具（chiplets）集成到一个包装中，提供了有希望的解决方案。 Chiplet还可以使离散芯片架构（例如CPU，GPU，DSP和FPGA）的异质整合。但是，高性能基于chiplet的系统的设计面临严重的挑战：芯片间交流是关键的瓶颈；资源需要在芯片中有效共享，以提高性能成本比率；需要优化功率和热管理，以获得更好的包装整合。因此，此类设计需要采取更全面的方法，并且需要对处理节点，存储和互连织物的横切问题进行研究。这项研究提议从异质的聚集芯片中构建“虚拟芯片”，以便该系统不仅可以从单片超级芯片中获得性能益处，而且可以破坏可扩展性瓶颈。该项目的主要结果将是一组优化方法，可以设计可重构体系结构，利用混合无线互连以无缝连接计算和内存组件。为此，研究目标包括：（1）设计可重构体系结构以打破chiplet边界以进行有效的资源共享； （2）开发模型，以量化应用程序和硬件资源之间的相互作用，以进行快速设计空间探索； （3）设计混合无线互连网络，以通过无线网络的灵活性无缝地弥合chiplets之间的物理间隙，并启用可重新配置的架构； （4）新型无线天线的设计以提高能量和热效率。拟议的研究弥合了设计堆栈多层之间的缝隙：硬件体系结构，网络和设备。由于其跨裁切性质，拟议的研究有可能改变高性能，节能和成本效益的系统的设计，这些系统能够满足随着带宽和性能需求增长的新兴应用的需求。 这项研究的教育贡献包括将研究与教学和培训，教程和研讨会的设计集成，重点是培训未来的工程师，以及与行业的互动以加速技术转移。通过推出活动作为拟议项目的一部分，将吸引更多的本科生和少数民族学生进入这一工程领域。该奖项反映了NSF的法定任务，并被认为是值得通过基金会的知识分子和更广泛影响的评估审查标准通过评估来获得支持的。

项目成果

3D-Printed Low-Profile X-Band Tunable Phase Shifter

3D 打印薄型 X 波段可调谐移相器

• DOI: 10.1109/wamicon57636.2023.10124923
• 发表时间: 2023
• 期刊: 2023 IEEE Wireless and Microwave Technology Conference (WAMICON
• 作者: Zhang, Hanxiang;Bahr, Ryan;Arigong, Bayaner
• 通讯作者: Arigong, Bayaner

Full 3D Coverage Beamforming Phased Array with Reduced Phase Shifters and Control 2D Tunable 3 × 3 Nolen Matrix

• DOI: 10.1109/past49659.2022.9975005
• 发表时间: 2022-10
• 期刊: 2022 IEEE International Symposium on Phased Array Systems & Technology (PAST)
• 作者: Hanxiang Zhang;Bayaner Arigona

A Wideband Isolated Real-to-Complex Impedance Transforming Uniplanar Microstrip Line Balun for Push–Pull Power Amplifier

• DOI: 10.1109/tmtt.2020.3019003
• 发表时间: 2020-09
• 期刊: IEEE Transactions on Microwave Theory and Techniques
• 影响因子: 4.3
• 作者: Md Hedayatullah Maktoomi;H. Ren;M. Marbell;Victor Klein;Richard Wilson;B. Arigong