Conference: 81st Device Research Conference (DRC)

非技术描述：该项目将利用NSF的支持，提高学生的参与度，并加强第81届器件研究会议（DRC）的技术培训，该会议汇集了来自世界各地的研究人员，分享他们在电子，光电和量子领域的最新发现半导体器件。2023年DRC将于6月25日至28日在加利福尼亚州圣巴巴拉的加州大学举行。DRC特别为学生和年轻的研究人员提供独特的培训和交流机会，帮助他们在材料科学，半导体技术和器件工程方面发展自己的职业生涯。刚果民主共和国致力于为所有与会者和各级人员促进更大的多样性和公平。通过鼓励对电子和光子器件的最新突破和进展进行公开和坦率的讨论，DRC将消除代表性不足的少数群体的障碍，并支持NSF的多样性使命，即“准备一个多样化的，全球参与的科学，技术，工程和数学劳动力”。技术说明：2023年DRC将举办三场全体会议，来自世界知名的电子-光子集成，印刷和柔性电子以及量子传输理论研究人员。会议将包括极端条件下的器件、2D器件、自旋电子器件、存储器件、RF和太赫兹器件、薄膜器件、功率器件和异构集成。除了全体会议和口头报告外，2023年DRC还将提供为期半天的“半导体行业二维材料”领域的技术短期课程，由该领域的知名专家授课。2023年DRC还将举办一个名为“是什么造就了一份优秀的设备论文，以及如何衡量其影响？”的后续会议。让听众就这些重要议题展开热烈而开放的讨论。为了鼓励学生参与，DRC每年颁发最佳学生论文奖和最佳学生海报奖。会议计划，包括剩余部分和短期课程，将大大提高会议对所有与会者的有用性。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

Non-Technical Description: This project will use NSF support to increase student participation and enhance technical training at the 81st Device Research Conference (DRC), which brings together researchers from around the world to share their latest findings in the areas of electronic, opto-electronic, and quantum-based semiconductor devices. The 2023 DRC will be held from June 25-28 at the University of California, Santa Barbara, CA. The DRC offers unique training and networking opportunities particularly to its student and young investigator attendees, helping them advance their careers in materials science, semiconductor technology, and device engineering. The DRC is committed to fostering greater diversity and equity for all attendees and at all levels. By stimulating an open and frank discussion of recent breakthroughs and advances in electronic and photonic devices, the DRC will remove barriers for underrepresented minority groups and support the NSF’s Diversity Mission related to “preparing a diverse, globally engaged science, technology, engineering and mathematics workforce.” Technical Description: The 2023 DRC will feature three plenary talks from world-renowned researchers in electronic-photonic integration, printed and flexible electronics, and quantum transport theory. The conference will include presentations on devices for extreme conditions, 2D devices, spintronic devices, memory devices, RF and terahertz devices, thin-film devices, power devices, and heterogeneous integration. In addition to plenary talks and oral presentations, the 2023 DRC will offer a half-day technical short course in the area of “Two dimensional materials for the semiconductor industry” taught by prominent experts in the field. The 2023 DRC will also feature a rump session titled “What makes a good device paper and how do you measure its impact?” to engage the audience in a vigorous and open discussion on these important topics. To encourage student engagement, the DRC gives awards every year for the Best Student Paper Award and the Best Student Poster Award. The conference program, including the rump session and the short course, will greatly enhance the usefulness of the conference to all attendees. The information will be disseminated through conference proceedings.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.