I-Corps: Translation potential of 3D electronics manufacturing by integrated 3D printing and freeform laser induction

I-Corps：通过集成 3D 打印和自由形式激光感应实现 3D 电子制造的转化潜力

• 批准号: 2412186
• 负责人: Jian Lin
• 金额: $ 5万
• 依托单位: University of Missouri-Columbia
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2024
• 资助国家: 美国
• 起止时间: 2024-04-01 至 2025-03-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2412186&HistoricalAwards=false
• 关键词: Corps; Translation; potential; 3D; electronics

The broader impact of this I-Corps project is the development of a fabrication methodology aimed at multi-functional 3D circuits. This approach integrates multiple fabrication techniques to address the challenges of high capital investment, waste generation, and limited material options associated with traditional methods. The potential societal impact lies in its ability to democratize access to advanced electronic manufacturing, thereby fostering innovation and economic growth. Furthermore, the commercialization of this technology holds promise for diverse industries, including healthcare, robotics, and flexible electronics, by offering scalable and cost-effective solutions for complex circuit fabrication.This I-Corps project utilizes experiential learning coupled with a first-hand investigation of the industry ecosystem to assess the translation potential of the technology. This solution is based on the development of a freeform multi-material assembly process, which integrates freeform laser induction, direct ink writing, and fused deposition modeling. The research focuses on addressing the unmet technological gaps in multi-functional 3D circuit fabrication by enabling versatile and scalable manufacturing of integrated electronic devices in diverse applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个I-Corps项目的更广泛的影响是针对多功能3D电路的制造方法的开发。这种方法集成了多种制造技术，以解决与传统方法相关的高资本投资，废物产生和有限材料选择的挑战。潜在的社会影响在于它能够使先进的电子制造业民主化，从而促进创新和经济增长。此外，通过为复杂电路制造提供可扩展且具有成本效益的解决方案，该技术的商业化为医疗保健、机器人和柔性电子等不同行业带来了希望。I-Corps项目利用体验式学习以及对行业生态系统的第一手调查来评估该技术的转化潜力。该解决方案基于自由形式的多材料组装工艺的开发，该工艺集成了自由形式的激光感应、直接墨水书写和熔融沉积成型。该研究的重点是通过在不同应用中实现多功能和可扩展的集成电子器件制造来解决多功能3D电路制造中未满足的技术差距。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估而被认为值得支持。