全印刷フレキシブル電子デバイスの実現に向けたナノ材料の機能性制御

纳米材料的功能控制以实现全印刷柔性电子器件

• 批准号: 21J13108
• 负责人: 李 玲穎
• 金额: $ 0.96万
• 依托单位: National Institute for Materials Science (2022)University of Tsukuba (2021)
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for JSPS Fellows
• 财政年份: 2021
• 资助国家: 日本
• 起止时间: 2021-04-28 至 2023-03-31
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-21J13108/
• 关键词: directed self-assembly; soft electronics; interfacial engineering; printed electronics; patterning; nanowires; ソフトエレクトロニクス; 自己組織化リソグラフィ; 表面・界面物性; パターニング; 付加製造; 有機トランジスタ; 透明導電フィルム; プリンテッドエレクトロニクス

Soft electronics, referring to electronic devices that are flexible, stretchable, and/or conformable to arbitrary surfaces, are expected to bring about a radical transformation in the period of the industrial revolution owing to their unparallel potential for numerous applications in advanced manufacturing fields. However, fabricating soft electronics that can replace existing products and be put into service in our daily lives is a grand challenge due to the lack of sustainable fabrication processes and competitive performance. Using an independently developed dual-surface-architectonic (DSA) strategy, a novel technology for solid-liquid interfacial engineering has been further demonstrated this year. This technology enables the spontaneous patterning of one-dimensional (1D) functional nanomaterials on polymer substrates in an ordered and scalable manner under ambient conditions. The unique liquid-solid interaction has been thoroughly explored and applied in the practical fabrication of cross-linked silver nanowires (AgNW) soft circuits as well as stretchable tension sensors with prominent conductivity and deformability. This breakthrough opens up new possibilities for liquid-mediated self-assembly technologies in the sustainable manufacturing of soft electronics, particularly for highly conformable skin-integrated sensor devices.

软电子，指的是柔性的，可拉伸的，和/或符合任意表面的电子设备，预计将在工业革命时期带来根本性的转变，因为它们在先进制造领域的众多应用中具有无与伦比的潜力。然而，由于缺乏可持续的制造工艺和具有竞争力的性能，制造可以取代现有产品并投入日常生活的软电子产品是一个巨大的挑战。利用自主开发的双表面架构（DSA）策略，今年进一步展示了一种用于固液界面工程的新技术。该技术能够在环境条件下以有序和可扩展的方式在聚合物基底上自发图案化一维（1D）功能纳米材料。独特的液-固相互作用已被彻底探索和应用于实际制作的交联银纳米线（AgNW）的软电路，以及具有突出的导电性和可变形性的可拉伸的张力传感器。这一突破为液体介导的自组装技术在软电子产品的可持续制造中开辟了新的可能性，特别是对于高度贴合的皮肤集成传感器设备。

项目成果

Flow-induced directed self-assembly strategies for high-resolution freeform soft electronics

高分辨率自由形式软电子器件的流诱导定向自组装策略

• 发表时间: 2022
• 作者: Lingying Li;Wanli Li;Mizuki Tenjimbayashi;Tomonobu Nakayama;Takeo Minari
• 通讯作者: Takeo Minari

2元表面アーキテクトニクスによる微細印刷エレクトロニクスの作製

通过二元表面结构制造微印刷电子产品

• 发表时间: 2021
• 作者: Lingying Li;Wanli Li;Mizuki Tenjimbayashi;Masayuki Kanehara;Tomonobu Nakayama;Takeo Minari
• 通讯作者: Takeo Minari

微細プリンテッドエレクトロニクス技術

微印刷电子技术

• 发表时间: 2022
• 作者: Lingying Li;Takeo Minari
• 通讯作者: Takeo Minari

A Liquid-Solid Nonequilibrium Heterointerface for Programmable Patterning of 1D-Nanowire-Based Soft Electronics

用于一维纳米线软电子可编程图案化的液固非平衡异质界面

• 发表时间: 2022
• 作者: Lingying Li;Wanli Li;Mizuki Tenjimbayashi;Masayuki Kanehara;Hiroyo Segawa;Chisato Niikura;Tomonobu Nakayama;Takeo Minari
• 通讯作者: Takeo Minari

Liquid-mediated Directed Self-assembly Strategy for Soft Electronics

软电子液体介导的定向自组装策略

• 发表时间: 2022
• 作者: Lingying Li;Wanli Li;Tomonobu Nakayama;Takeo Minari
• 通讯作者: Takeo Minari