Wide-area SEM observation of dislocation structures and the restructuring of fracture estimation model

利用电子通道对比成像技术（ECCI）和电子背散射衍射技术（EBSD）分析了不同条件下断裂金属材料的微观结构。电子通道对比成像技术可以在扫描电子显微镜下观察到位错。在微观组织分析的基础上，提出了确定断裂过程的方法，研究了影响裂纹扩展路径和裂纹起裂部位的因素。利用这些技术还可以对超细晶材料的疲劳损伤进行估计。

Microstructures of metallic materials fractured under various conditions were analyzed using the electron channelling contrast imaging (ECCI) technique which enables us to observe dislocation in a scanning electron microscope, and the electron backscatter diffraction (EBSD) technique. Based on the microstructure analyses, we developed the method to determine fracture process, and investigated factors which determine crack propagation path and crack initiation site. Fatigue damage of ultrafine-grained materials could also be estimated with these techniques.