Higher, more precise, multifunctional - From micro- to mesoscale structures through 'next-level laser lithography' as the core building block of a high-performance process technology (mesoTrace)

光刻技术制造轮廓高度在几十到几百微米之间的功能结构，同时满足非常高的精度要求，并扩展到很大的横向范围，目前的可能性非常有限。这些结构解决了微观尺度和中尺度之间的过渡，提供了非常高的潜力，特别是在光学和半导体技术中，提供了以前无法或仅仅无法实现的特性。来自光学的例子有：(i)同时利用高和低衍射阶的衍射结构，（ii）自由弯曲折射表面上衍射结构的混合元件，或（iii）具有统计或周期性分布和不同透镜几何形状的深度定制微透镜阵列。在半导体技术中，中尺度掩膜结构可用于掺杂功率半导体器件，这是可再生能源领域高效能量转换所必需的。本项目旨在从微观到中尺度的过渡范围内显著超越以往功能结构的可制造性限制，并从根本上探索可用的技术。该项目的主要目标是获得最先进的直写激光光刻系统。项目主要从三个科学方面着手：A)克服激光光刻技术以往的局限性。这涉及到可实现的轮廓高度大幅增加到180 μ m的范围内，减少了令人不安的“缝合”效应，以及减少了表面粗糙度。B)激光光刻与后续等离子体刻蚀工艺的结合：研究了干刻蚀工艺对深度和高精度光刻胶结构转移的限制。C)精心设计的“中尺度”结构的性质和功能。最后，新获得的结构将用于正在进行的科学项目，特别是用于高光谱和多模态光学仪器以及离子辐照半导体器件。该团队由四位能力互补的合作伙伴组成：Brunner， r<e:1>和Schie教授（EAH-Jena）结合了纳米和微观结构制造及其在多模态光学系统和半导体制造中的应用方面的相关经验。Dr. H. Hillmer教授（卡塞尔大学）的能力为微纳米技术以及光谱传感应用的微光学结构研究提供了出色的协同效应。

The possibilities for the lithographic fabrication of functional structures with profile heights in the dimensions from a few tens to several hundred micrometers, which simultaneously meet very high accuracy requirements and extend over large lateral ranges, are currently very limited. These structures, which address the transition between the micro- and the mesoscale, offer a very high potential, especially in optics and semiconductor technology, to provide properties that were previously not or only insufficiently attainable. Examples from optics are: (i) diffractive structures simultaneously utilizing high and low diffraction orders, (ii) hybrid elements of diffractive structures on free-form curved refractive surfaces, or (iii) deep, tailored microlens arrays with statistical or periodic distribution and varying lens geometry. In semiconductor technology, mesoscale mask structures can be used e.g. for doping power semiconductor devices that are necessary for efficient energy conversion in the field of renewable energies. This project aims to significantly exceed previous limits in the manufacturability of functional structures in the transition range from the micro- to the mesoscale and to fundamentally explore the usable technologies. The primary objective of the project is the acquisition of a state-of-the-art direct-writing laser lithography system.The project mainly follows three scientific aspects: A) Overcome previous limitations of laser lithography. This concerns the considerable increase of achievable profile heights into the range up to 180 µm, a reduction of disturbing 'stitching' effects as well as the reduction of surface roughness, over extended areas. B) Combination of laser lithography with subsequent plasma etching processes: The limits of the structure transfer for deep and highly precise photoresist structures by dry etching processes are investigated. C) Properties and functionalities of the elaborated 'mesoscale' structures. Finally, the newly available structures will be used for ongoing scientific projects, in particular for hyperspectral and multimodal optical instrumentation and for ion-irradiated semiconductor devices.The team consists of four partners whose competences complement each other excellently: Professors Brunner, Rüb and Schie (EAH-Jena) combine relevant experience in the fabrication of nano- and microstructures and their use in multimodal optical systems as well as in semiconductor manufacturing. The competence profile of Prof. Dr. H. Hillmer (University of Kassel) offers excellent synergies to micro- and nanotechnology as well as to the research of micro-optical structures for spectral sensing applications.