Direct Writer for MicroNano-Structuring

微纳米结构直接写入器

• 批准号: 501120556
• 金额: --
• 依托单位: Technische Universität Braunschweig
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2022
• 资助国家: 德国
• 起止时间: 2021-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/501120556?language=en
• 关键词: Direct; Writer; MicroNano; Structuring

In microtechnology, a distinction is made between mask-based and direct-writing lithographic patterning processes. With a direct-writing patterning process, the microstructure is projected directly onto the resist layer of the actual substrate with the aid of a UV light modulator or "written" with the UV laser beam in the vector/raster mode process. Especially in the research environment, maskless patterning saves time, money and energy. In addition, a direct-writing patterning process can be used to respond much more flexibly to changing microstructure requirements. The applicant Institute of Microtechnology (IMT) has so far exclusively used the mask-based structuring process. A mask writer for the production of the lithography masks and a mask aligner for the substrate exposure are currently available for this purpose. The mask writer was purchased in 2002 and therefore no longer corresponds to the current state of the art. This primarily concerns the minimum possible pattern width or resolution (800 nm) and secondarily the time required for complete exposure of a lithography mask (8 to 16 hours). In principle, the mask writer can also be used in direct-writing mode. However, with the exposure times mentioned, this is hardly practical. It is also not used because no structures significantly smaller than 1 µm can be generated. In order to bring the structuring process up to the best possible technological level and thus give research at the IMT an edge over conventional processes already in industrial use, a new structuring system is to be procured. It is intended to halve the minimum structure widths and reduce the time required to process a substrate to a level acceptable in research. The structuring system should be very flexible in use, which is only possible with a direct-writing process. In addition, it should have a new function compared to the existing equipment with the so-called gray scale exposure, with which an innovative 3D structuring is possible due to the additional depth information. Lithographic structuring is used in almost every research project worked on at the IMT. With the new direct writer, many more variations of micro/nanostructuring will be possible. This leads to the expectation that completely new solutions for existing research tasks can be worked out and new ideas for future research approaches can be developed. The IMT could thus clearly distinguish itself from research institutions with an otherwise similar technological orientation. Innovative research approaches made possible in this way can be published more prominently and are more attractive for transfer to future, e.g. industrial, users.

在微技术中，基于掩模的光刻图案化工艺和直接写入光刻图案化工艺之间存在区别。在直写图案化工艺中，微结构在UV光调制器的帮助下直接投射到实际衬底的抗蚀剂层上，或者在矢量/光栅模式工艺中用UV激光束“写入”。特别是在研究环境中，无掩模图案化节省了时间、金钱和能源。此外，直接写入图案化工艺可用于更灵活地响应变化的微结构要求。申请人微技术研究所（IMT）迄今为止仅使用基于掩模的结构化过程。用于生产光刻掩模的掩模写入器和用于衬底曝光的掩模对准器目前可用于此目的。掩模写入器是在2002年购买的，因此不再符合当前的技术水平。这主要涉及最小可能的图案宽度或分辨率（800 nm），其次是光刻掩模完全曝光所需的时间（8至16小时）。原则上，掩模写入器也可以用于直接写入模式。然而，由于提到的曝光时间，这几乎是不切实际的。它也没有被使用，因为不能产生明显小于1 μm的结构。为了使结构化过程达到最佳技术水平，从而使IMT的研究优于工业上已经使用的传统过程，将采购一种新的结构化系统。其目的是将最小结构宽度减半，并将处理衬底所需的时间减少到研究中可接受的水平。结构化系统在使用上应该非常灵活，这只有在直接写入过程中才有可能。此外，与具有所谓的灰度曝光的现有设备相比，它应该具有新功能，由于附加的深度信息，利用灰度曝光可以进行创新的3D结构化。IMT的几乎每个研究项目都使用光刻结构。有了新的直写器，更多的微/纳米结构的变化将是可能的。这导致了期望，可以制定出全新的解决方案，为现有的研究任务和新的想法，为未来的研究方法可以开发。因此，IMT可以明显地将自己与其他类似技术方向的研究机构区分开来。以这种方式使创新的研究方法成为可能，可以更突出地发表，更有吸引力地转让给未来的用户，如工业用户。