On-Wafer Measurement System for the Analysis of Integrated Submillimeter-Wave Circuits

用于分析集成亚毫米波电路的晶圆上测量系统

• 批准号: 504139189
• 金额: --
• 依托单位: Universität Ulm
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2022
• 资助国家: 德国
• 起止时间: 2021-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/504139189?language=en
• 关键词: Wafer; Measurement; System; Analysis; Integrated

A central research focus of the Institute of Electronic Devices and Circuits at Ulm University is the research and investigation of circuits and integrated system concepts for extremely broadband sensors and communication systems. In both areas, the goal is to realization of high carrier frequencies for the realization of unprecedented baseband bandwidths far maximum data rates and highest sensing resolutions on the basis of highly-integrated and cost-efficient integrated circuit technology (mainly silicon-germanium). A further increase in carrier frequencies into the submillimeter-wave regime and the directly linked increase of absolute bandwidth for approximately constant relative bandwidths enables significant progress in the area of precision miniaturized radar sensors, spectroscopy applications such as gas sensing and material characterization. The use of these extremely high bandwidths further allows future wireless communication with huge data rates beyond 100 Gbaud/s.The characterization of designed integrated transceivers and their circuit building blocks, as well as the determination of material parameters and high-frequency transfer functions of propagations paths necessitates corresponding measurement technology in the form of submillimeter-wave S-parameter probing. For the active integrated circuits, it needs to include additional possibilities for the determination of noise, linearity, and signal quality. Beyond that, the measurement station needs to obey modern circuit implementation trends and feature frequency-converting measurements. The characterization is performed directly at the pads of the designed ICs, and especially single building blocks, and necessitates a co-implementation and compatibility of the measurement equipment with a high-frequency on-wafer probe station.

ULM大学电子设备和电路研究所的中心研究重点是对极端宽带传感器和通信系统的电路和集成系统概念的研究和研究。在这两个方面，目标是实现前所未有的基带带宽的高载体频率，并根据高度集成和成本效益的集成电路技术（主要是硅球形）的最高数据速率和最高的感应分辨率。载体频率进一步增加到亚毫升波状态，以及与近似恒定的相对带宽的绝对带宽的直接相连的增加，可以在精确微型化的雷达传感器，诸如气体传感和材料表征之类的光谱雷达传感器的领域中取得显着进展。这些极高的带宽的使用进一步允许将来的无线通信，其巨大的数据速率超过100 GBAUD/S.设计的集成收发器及其电路构建块的表征，以及确定材料参数的确定材料参数和高频传递路径的高频传递函数，必要以相应的测量技术形式，以超计型波孔孔板的形式形式。对于主动集成电路，它需要包括确定噪声，线性和信号质量的其他可能性。除此之外，测量站还需要遵守现代电路实施趋势和特征转换测量值。 The characterization is performed directly at the pads of the designed ICs, and especially single building blocks, and necessitates a co-implementation and compatibility of the measurement equipment with a high-frequency on-wafer probe station.