Facility for enabling low thermal budget Si/SiGe technologies

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This project aims to enhance Australian micro/nano fabrication capability and strengthen research across a range of key technologies by establishing an advanced state-of-the art semiconductor facility that enables deposition of wide range of silicon-based films at low thermal budget. The facility is expected to provide unique capabilities that are not currently available in Australia. The expected outcomes include: (i) development of 3D integration approaches on CMOS Integrated Circuit that will be necessary for the rapidly growing applications in Artificial Intelligence, Internet-of-Things, and Wearables; (ii) thick electrically active silicon-based films for Biomedical, Telecommunication, Photonics, and Micro Electro Mechanical Systems.