Three-dimensional transient piezothermoelastic analysis and optimal design for intelligent functionally graded materials/composite materials associated with piezoelectric material

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In this research project, the three-dimensional transient piezothermoelactic problems for intelligent functionally graded materials/composite materials constructed of heat resistant structural material and piezoelectric material are treated theoretically, taking into account the coupling effects of the thermoelastic field and electric field. By using the solutions for functionally graded materials or composite materials and the solutions for piezoelectric material, the theoretical analyses for combined intelligent models are developed. The analyses are carried as follows.・Transient thermoelactic analysis of functionally graded materials or composite materials・Transient piezothermoelactic analysis of piezoelectric materials・Transient piezothermoelactic analysis of intelligent functionally graded materials/composite materials associated with piezoelectric materialThe exact solutions for the rectangular plates, strips and cylindrical panels and the apploximate solutions for the cylindrical panels are obtained. And the following items are estimated qualitatively and quantitatively by the numerical calculations.1. Influence of the coupling effects of the thermoelastic field and electric field on the displacements and stresses2. Transient behaviors for the temperature change, thermal displacement, thermal stress (transverse shearing stresses and the normal stress in the thickness direction, those become a cause of delamination especially), electric potential and electric displacement distributions3. Effects of the electric surface charge on the thermal displacements and thermal stresses4. Efficiency for the approximate solutions of the cylindrical panelsFurthermore the control problems of the transient thermoelastic displacement of intelligent functionally graded materials/composite materials associated with piezoelectric material and the optimization of material composition of a functionally graded rectangular plate bonded to a piezoelectric plate are treated.