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STUDY ON DISSIMILAR METAL BONDING WITH NANO-METER SIZE CRYSTAL INTO BOND INTERFACE AND REACTION AT BOND INTERFACE BY HEAT TREATMENT

纳米尺寸晶体异种金属热处理接合界面及界面反应研究

基本信息

批准号：
15360390
负责人：
NISHIO Kazumasa
金额：
$ 6.08万
依托单位：
Kyusyu Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2003
资助国家：
日本
起止时间：
2003 至 2005
项目状态：
已结题

项目摘要

We made clad materials such as Al/Ti, Al/Steel and Al/Cu using the vacuum roll bonding apparatus developed by us. Effects of roll reduction and bond temperature on bond tensile strength of these clad materials, optical microstructures and high resolution TEM structures on the bond interfaces between dissimilar metals have been investigated. And also, changes of microstructure on the bond interface between the dissimilar metals have been observed after heat treatments. Main results obtained are as follows. (1) Bond tensile strength of these clad materials increased with increases of reduction and bond temperature. (2) Amorphous, nano-meter crystal structure and inter-metallic compounds in very thin thickness were observed using TEM. (3) The bond mechanism of the vacuum roll bonding method is considered as below. The softer metal composed the clad material is elongated largely compared with the harder metal during the bonding and friction heat is generated at the bond interface. The bond interface is abruptly cooled and the amorphous and nano-meter crystal are formed after bonding. (4) Inter-metallic compounds grew up accordingly by the diffusion controlled after heat treatments.

利用自行研制的真空滚压焊接机，制备了Al/Ti、Al/钢、Al/Cu等复合材料。研究了轧辊压下量和结合温度对复合层结合强度的影响，以及光学组织和高分辨透射电子显微镜对异种金属间结合界面的影响。此外，还观察到了热处理后异种金属间结合界面微观结构的变化。取得的主要结果如下。(1)复合材料的结合强度随压下量和结合温度的升高而增加。(2)用透射电子显微镜观察到了非晶态、纳米级的晶体结构和极薄的金属间化合物。(3)真空滚压键合的粘结机理如下。在粘接过程中，与硬质金属相比，组成覆层材料的较软金属被拉长很多，并在粘接界面产生摩擦热。结合界面突然冷却，结合后形成非晶态和纳米晶体。(4)金属间化合物受热处理后的扩散控制相应长大。