Defect Monitoring by the Active/Passive Electric Potential CT Method Using Inverse Analysis and Smart Layer

为了监测结构中的缺陷和裂纹，将压电薄膜与印刷电路相结合，构建了智能层。该智能层采用被动电势CT法测量薄膜上的电势，采用主动电势CT法发射声波。通过将这些方法与一种逆方法相结合，有效地估计了裂纹的尺寸和位置。从智能层电极发射和接收的声波信号估计裂纹形状。

For monitoring defects and cracks in structures, a smart layer was constructed by combining piezoelectric film and a printed circuit. By using the smart layer the electric potential on the film was measured in the passive electric potential CT method and an acoustic wave was emitted in the active electric potential CT method. By combining these methods with an inverse method, the crack size and location were effectively estimated. Crack shapes were estimated from acoustic wave signals emitted and received from and to electrodes on the smart layer.