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Development of high-speed cutting technology of brittle materials by laser

脆性材料激光高速切割技术的发展

基本信息

批准号：
19560739
负责人：
HARA Youichiro
金额：
$ 3万
依托单位：
Sasebo National College of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2007
资助国家：
日本
起止时间：
2007 至 2009
项目状态：
已结题

项目摘要

The scribing process is necessary for cutting glass, and a wheel cutter is used for it. Recently, however, the scribing process that guides a crack only on the surface is using the thermal stress generated by laser irradiation. Compared with the conventional method, there is no micro crack and flatness in a cross section.Furthermore, since the chips of glass are not generated, it is the method whose manufacturing efficiency is high. This research describes about the laser scribing method using the new heating point by CO_2 laser, experiments the laser scribing processing in this method, and examines the possibility of a new laser scribe process based on the result.

玻璃切割需要划线工艺，通常使用轮刀。但最近，仅在表面引导裂纹的划线工艺正在使用激光照射产生的热应力。与现有技术相比，在截面上没有微小的裂纹和平坦度，而且，由于不产生玻璃碎片，因此是制造效率高的方法。本文介绍了利用CO_2激光器新的加热点进行激光划片的方法，并在此方法下进行了激光划片工艺的实验，在此基础上探讨了新的激光划片工艺的可能性。