Development of high-speed cutting technology of brittle materials by laser

划线是切割玻璃所必需的，使用的是轮式切割机。然而，最近，仅在表面引导裂纹的划线过程正在使用激光照射产生的热应力。与传统方法相比，该方法在横截面上没有微裂纹和平整度，而且由于不会产生玻璃碎屑，是一种制造效率高的方法。本研究描述了利用CO_2激光器的新加热点进行激光划片的方法，对激光划片工艺进行了实验，并在此基础上探讨了一种新的激光划片工艺的可能性。

The scribing process is necessary for cutting glass, and a wheel cutter is used for it. Recently, however, the scribing process that guides a crack only on the surface is using the thermal stress generated by laser irradiation. Compared with the conventional method, there is no micro crack and flatness in a cross section.Furthermore, since the chips of glass are not generated, it is the method whose manufacturing efficiency is high. This research describes about the laser scribing method using the new heating point by CO_2 laser, experiments the laser scribing processing in this method, and examines the possibility of a new laser scribe process based on the result.