Development of high-speed cutting technology of brittle materials by laser

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The scribing process is necessary for cutting glass, and a wheel cutter is used for it. Recently, however, the scribing process that guides a crack only on the surface is using the thermal stress generated by laser irradiation. Compared with the conventional method, there is no micro crack and flatness in a cross section.Furthermore, since the chips of glass are not generated, it is the method whose manufacturing efficiency is high. This research describes about the laser scribing method using the new heating point by CO_2 laser, experiments the laser scribing processing in this method, and examines the possibility of a new laser scribe process based on the result.