Fundamental Research on Fracture Prediction Monitoring of Adhesive Bonded Structure using PVDF Film.

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PVDF films have features of high output voltage, linearity for dynamic loads, and flexibility that the film geometry can be changed freely. The film is available as a sensor with neither power sources nor amplifiers. In this study, the strain distribution near adhesive interfaces is measured in the two following methods-one with PVDF films and the other with strain gauges-for comparison. The effect on measurement accuracy is investigated both by epoxy adhesive and conductive adhesive as glue on the joint specimen. As a result, the strain measurement method using PVDF films was also applicable in joining problem by adhesive, and it was proved that the tendency of strain distribution measured with PVDF films bonded by conductive adhesive is similar to that measured with strain gauges.