The void and mechanism of heat conduction by thermal phonon in liquids

在估算热容、热导率和声速随温度、数密度、原子质量和填充率的变化关系的基础上，成功地用数密度和填充率表示了热载流子在液氩中的平均自由程。使用WCA势的评估结果表明，计算的简单液体和熔融盐的热导率的温度和包装分数的依赖性的起源是可追溯到在电位的排斥部分的软。

The mean free path of thermal carrier in liquid argon has successfully been expressed with number density and packing fraction on the basis of the evaluated results of the dependences of heat capacity, thermal conductivity, and sound velocity on temperature, number density, atomic mass, and packing fraction. The results of evaluation using the WCA potentials reveal that the origin of dependences of the calculated thermal conductivity of simple liquids and molten salts on temperature and packing fraction is traceable to the softness of repulsive part in the potentials.